IP Library Granted Patent US 7,843,684
Granted Patent B2
US 7,843,684 · App. 12/428,477 · Granted Nov 30, 2010

Waterproof and heat-dissipating module mounted for an electronic device

Assignees: Silitek Electronic (Guangzhou) Co., Ltd.; Lite-On Technology Corp.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,843,684
App. No.
12/428,477
Granted
Nov 30, 2010
Kind
B2
Abstract

A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Claims (24)

1. A waterproof and heat-dissipating structure comprising:

a housing structure, with a first ventilation hole, a second ventilation hole, a first drainage hole, and a second drainage hole being formed on the housing structure;

a compartment structure disposed inside and partitioning an inside space of the housing structure, the compartment structure comprising:

an inhaling chamber comprising:

an inhaling chamber bottom disposed relative to the first drainage hole; and

an inhaling chamber neck having an inlet misaligned with the first ventilation hole;

a fan room;

an accommodated space for accommodating a circuit board; and

an exhausting chamber comprising:

an exhausting chamber bottom disposed relative to the second drainage hole;

an exhausting chamber neck having an outlet; and

a waterproof slab disposed between the exhausting chamber neck and the second ventilation hole for separating the outlet of the exhausting chamber neck and the second ventilation hole; and

a fan disposed inside the fan room for guiding airflow to pass through the first ventilation hole, the inhaling chamber, the fan room, the accommodated space, the exhausting chamber, and the second ventilation hole in a sequence.

2. The waterproof and heat-dissipating structure of claim 1 , wherein the airflow driven by the fan flows into the inhaling chamber through the first drainage hole.

3. The waterproof and heat-dissipating structure of claim 1 , wherein the air driven by the fan flows out the exhausting chamber through the second drainage hole.

4. The waterproof and heat-dissipating structure of claim 1 , wherein the housing structure is composed of an upper housing and a lower housing engaging to each other closely.

5. The waterproof and heat-dissipating structure of claim 1 , wherein a plurality of fake holes of the housing structure is aligned with the inhaling chamber neck and the first ventilation hole is disposed on two sides of the plurality of fake holes.

6. The waterproof and heat-dissipating structure of claim 4 , wherein the inhaling chamber, the fan room, and the exhausting chamber are disposed on the upper housing and the accommodated space is disposed on the lower housing, and the inhaling chamber, the fan room, and the exhausting chamber are parallel to the accommodated space.

7. The waterproof and heat-dissipating structure of claim 1 , wherein the fan room having an inlet connected to a top opening of the fan and an outlet of the inhaling chamber neck, and an outlet connected to a lateral opening of the fan and the accommodated space are formed on the fan room.

8. The waterproof and heat-dissipating structure of claim 1 , wherein length of the inhaling chamber neck is related to air inhaling force from the fan room.

9. The waterproof and heat-dissipating structure of claim 1 , wherein an inclined slab extended from the exhausting chamber neck is disposed surrounding an inlet of the exhausting chamber neck.

10. The waterproof and heat-dissipating structure of claim 1 , wherein an inclined slab extended from the inhaling chamber neck is disposed surrounding the outlet of the inhaling chamber neck.

11. The waterproof and heat-dissipating structure of claim 9 , wherein an angle between an inclined surface of the inclined slab, stretching from a side far from the exhausting chamber neck to a side connecting with the exhausting chamber neck, and the compartment structure is between 3 degrees and 30 degrees.

12. The waterproof and heat-dissipating structure of claim 9 , wherein an angle between an inclined surface of the inclined slab, stretching from a side far from the inhaling chamber neck to a side connecting with the inhaling chamber neck, and the compartment structure is between 3 degrees and 30 degrees.

Assignments (2)
CHANGE OF NAME Recorded Nov 4, 2013
From: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
To: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
Reel/Frame 031579/0743 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2009
From: LU, YI-JEN; LIN, SHU-HSIEN
To: SILITEK ELECTRONIC(GUANGZHOU)CO.,LTD.; LITE-ON TECHNOLOGY CORP.
Reel/Frame 022583/0778 →
Priority Claims (1)
CN 2009 1 0037122 · Feb 5, 2009 · national
Continuity (1)
Related Publication 20100195282A1 · Aug 5, 2010