Optical interconnection structure and method for manufacturing the same

1. An optical interconnection structure comprising:

a silicon substrate on which a first groove for a lens is formed to have a curvature radius on the upper surface thereof;

a silica layer that is formed on the silicon substrate including the first groove for a lens, the silica layer including a first curved portion retaining the shape of the first groove for a lens, the silica layer including a first curved portion retaining the shape of the first groove for a lens;

a first via hole formed on a lower surface of the silicon substrate to expose the first curved portion;

an optical waveguide comprising a lower cladding layer formed on the upper surface of the silica layer, the lower cladding layer having a depth sufficient to fill the first curved portion;

a core layer formed on the upper surface of the lower cladding layer; and

an upper cladding layer formed on the upper surface of the core layer.

2. The optical interconnection structure according to claim 1 , further comprising: a second curved portion of the silica layer retaining the shape of a second groove for a lens and a second via hole, spaced apart from the first curved portion and the first via hole, respectively, by a predetermined interval;

a laser diode coupled to a lower surface of the silicon substrate under the first via hole and a photodiode coupled to the lower surface of the silicon substrate under the second via hole;

a driver coupled to the lower surface of the silicon substrate for driving the laser diode; and

a receiver coupled to the lower surface of the silicon substrate for converting received optical signals into electric signals.

3. The optical interconnection structure according to claim 2 , further comprising a first mirror groove disposed over the first via hole and positioned to reflect light transmitted through the first via hole into the optical waveguide; and

a second mirror groove disposed over the second via hole and positioned to reflect light from the optical waveguide into the second via hole.

4. An optical interconnection structure comprising:

a silicon substrate on which a first groove for a lens is formed to have a curvature radius on the upper surface thereof;

a silica layer that is formed on the silicon substrate including the first groove for a lens, the silica layer including a first curved portion retaining the shape of the first groove for a lens;

a first via hole formed on a lower surface of the silicon substrate to expose the first curved portion;

a first microlens disposed in the first curved portion;

a second groove for a lens formed on the silicon substrate;

a second curved portion comprising a portion of the silica layer retaining the shape of the second groove for a lens;

a second microlens disposed in the second curved portion;

a second via hole disposed under the second microlens;

a laser diode coupled to a lower surface of the silicon substrate under the first via hole;

a photodiode coupled to the lower surface of the silicon substrate under the second via hole;

a driver coupled to the lower surface of the silicon substrate for driving the laser diode;

a receiver coupled to the lower surface of the silicon substrate for converting received optical signals into electric signals; and

an optical interconnection member comprising first and second fibers coupled to the upper surface of the silica layer,

wherein the optical interconnection member is coupled to the upper surface of the silica layer to transmit light from the first microlens to the first optical fiber, and to transmit light from the second optical fiber to the second microlens.

5. A method for manufacturing an optical interconnection structure comprising:

(a) forming a first groove for a lens having a curvature radius on the upper surface of a silicon substrate;

(b) forming a silica layer on the entire upper surface of the silicon substrate including the groove formed with the lens, the silica layer filling the groove for a lens to form a first curved portion;

forming an optical waveguide by sequentially stacking a lower cladding layer, a core layer, and an upper cladding layer on the entire upper surface of the silicon substrate; and

forming via holes on the lower surface of the silicon substrate to expose the first curved portion.

6. The method for manufacturing an optical interconnection structure according to claim 5 , further comprising:

forming a second groove for a lens, wherein the step of forming a silica layer fills the second groove for a lens;

forming a second via hole under the second groove for a lens;

attaching a laser diode and a photodiode to a lower surface of the silicon substrate under the first and second via holes, respectively; and

attaching a driver for driving the laser diode and a receiver for converting received optical signals into electric signals to the lower surface of the silicon substrate.

7. The method for manufacturing an optical interconnection structure according to claim 6 , further comprising:

forming a first mirror groove over the first via hole on the upper surface of the optical waveguide, the first mirror groove being arranged to reflect light from the first via hole into the optical waveguide; and

forming a second mirror groove over the second via hole on the upper surface of the optical waveguide, the second mirror groove being arranged to reflect light from the optical waveguide into the second via hole.