Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith
A photosensitive insulating resin composition capable of forming an interlayer insulating film, or planarized film, or surface protective film, or insulating film for high-density mount substrate excelling in properties, such as resolution, adherence, thermal impact, electrical insulation, patterning performance and elongation; a hardening product thereof; and a circuit board equipped with the hardening product. There is provided a positive photosensitive insulating resin composition comprising an alkali-soluble resin; a compound having a quinonediazido group; and crosslinked resin particles of a particulate copolymer whose 20 to 90 mol % constituent is derived from a hydroxylated and/or carboxylated monomer.
1. A positive-type photosensitive insulation resin composition characterized by comprising an alkali-soluble resin, a compound having a quinone-diazide group, a crosslinked resin particle consisting of a particulate copolymer containing a constituent derived from a monomer having a hydroxyl group and/or a carboxyl group in an amount of 20% to 90% by mol, and a compound having two or more oxirane rings in its molecule.
2. The positive-type photosensitive insulation resin composition according to claim 1 , wherein said alkali-soluble resin is an alkali-soluble resin having a phenolic hydroxyl group.
3. The positive-type photosensitive insulation resin composition according claim 1 , further comprising a crosslinking agent.
4. The positive-type photosensitive insulation resin composition according to claim 1 , wherein said monomer having a hydroxyl group and/or a carboxyl group is at least one compound selected from the group consisting of hydroxyethyl(meth)acrylate, hydroxypropyl(meth)acrylate, hydroxybutyl(meth)acrylate, (meth)acrylic acid, itaconic acid, β-(meth)acryloxyethyl succinate, β-(meth)acryloxyethyl maleate, β-(meth)acryloxyethyl phthalate and β-(meth)acryloxyethyl hexahydrophthalate.
5. The positive-type photosensitive insulation resin composition according to claim 1 , wherein said crosslinked resin particle is consisting of a copolymer of said monomer having a hydroxyl group and/or a carboxyl group and a crosslinkable monomer having two or more polymerizable unsaturated groups.
6. The positive-type photosensitive insulation resin composition according to claim 1 , wherein average diameter of said crosslinked resin particle is in the range from 50 to 120 nm.
7. A hardened material characterized by being formed by hardening said positive-type photosensitive insulation resin composition according to claim 1 .
8. A circuit board characterized by comprising said hardened material according to claim 7 as an interlayer insulation film or a planarized film.
9. A negative-type photosensitive insulation resin composition characterized by comprising an alkali-soluble resin, a crosslinking agent, a photosensitive acid generator, a crosslinked resin particle consisting of a particulate copolymer containing a constituent derived from a monomer having a hydroxyl group and/or a carboxyl group in an amount of 20% to 90% by mol, and a compound having two or more oxirane rings in its molecule.
10. The negative-type photosensitive insulation resin composition according to claim 9 , wherein said alkali-soluble resin is an alkali-soluble resin having a phenolic hydroxyl group.
11. The negative-type photosensitive insulation resin composition according to claim 9 , wherein said monomer having a hydroxyl group and/or a carboxyl group is at least one compound selected from the group consisting of hydroxyethyl(meth)acrylate, hydroxypropyl(meth)acrylate, hydroxybutyl(meth)acrylate, (meth)acrylic acid, itaconic acid, β-(meth)acryloxyethyl succinate, β-(meth)acryloxyethyl maleate, β-(meth)acryloxyethyl phthalate and β-(meth)acryloxyethyl hexahydrophthalate.
12. The negative-type photosensitive insulation resin composition according to claim 9 , wherein said crosslinked resin particle is consisting of a copolymer of said monomer having a hydroxyl group and/or a carboxyl group and a crosslinkable monomer having two or more polymerizable unsaturated groups.
13. The negative-type photosensitive insulation resin composition according to claim 9 , wherein average diameter of said crosslinked resin particle is in the range from 50 to 120 nm.
14. A hardened material characterized by being formed by hardening said negative-type photosensitive insulation resin composition according to claim 9 .
15. A circuit board characterized by comprising said hardened material according to claim 14 as an interlayer insulation film or a planarized film.