IP Library › Granted Patent US 8,234,511
Granted Patent B2
US 8,234,511 · App. 12/446,881 · Granted Jul 31, 2012

Speed binning for dynamic and adaptive power control

Assignee: Agere Systems Inc.
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Quick Facts
Patent No.
US 8,234,511
App. No.
12/446,881
Granted
Jul 31, 2012
Kind
B2
Abstract

A representative digital circuit of the invention has an on-chip, non-volatile memory, to which chip-specific speed-binning data that characterize performance of the digital circuit are written during production testing. During normal operation, the power controller that controls power-supply signals applied to the digital circuit reads the speed-binning data from the on-chip memory for use as input parameters for dynamic supply-voltage scaling, dynamic clock scaling, and/or adaptive power control that optimize (e.g., minimize) power consumption in the digital circuit. Advantageously over the prior art, the accuracy and efficiency of dynamic and/or adaptive power control arc improved because the chip-specific speed-binning data enable the power controller to better customize the power-management algorithm for the given digital circuit.

Claims (61)

1. A device, comprising:

a processor core configured to receive a first power-supply signal;

a digital circuit configured to receive a second power-supply signal different from the first power-supply signal;

a power controller adapted to control the first and second power-supply signals; and

a memory adapted to store speed-binning test data that characterize performance of said processor core and said digital circuit, wherein the power controller is adapted to access said speed-binning test data to set one or more levels of said first and second power-supply signals.

2. The device of claim 1 , wherein the power controller is adapted to use said speed-binning test data to customize at least one of adaptive power control and dynamic power control for said processor core and said digital circuit.

3. The device of claim 1 , wherein the speed-binning test data has been generated and stored in said memory during production testing of the device, said speed-binning enabling adjustment of the first and second power supply signals with an increment corresponding to an operational speed increment of about 6 MHz.

4. The device of claim 3 , wherein the speed-binning data comprise one or more supply voltages at which the digital circuit and the processor core have passed testing employing one or more respective speed-binning test vectors.

5. The device of claim 1 , wherein the memory is a one-time programmable fuse block.

6. The device of claim 1 , wherein the power controller is adapted to (i) determine a speed constraint for a task to be executed by the digital circuit and the processor core and (ii) specify one or more levels of said first power-supply signal for the execution of said task based on said speed constraint and said speed-binning test data.

7. The device of claim 1 , further comprising a sensor adapted to sense temperature of the processor core, wherein the power controller is adapted to specify one or more levels of said first power-supply signal based on a temperature reading obtained from said sensor.

8. The device of claim 1 , further comprising a power management unit adapted to:

receive instructions from the power controller regarding the one or more levels of said first and second power-supply signals; and

generate said first and second power-supply signals based on said instructions.

9. The device of claim 8 , wherein the power controller and the power management unit comply with a PowerWise™ Interface Specification.

10. The device of claim 8 , wherein:

the device is implemented using a chipset having first and second integrated circuits;

the memory, the power controller, the processor core, and the digital circuit are parts of the first integrated circuit; and

the power management unit is part of the second integrated circuit.

11. The device of claim 1 , wherein the digital circuit and the processor core are parts of a digital base-band circuit for cellular telephony.

12. The device of claim 1 , wherein:

the digital circuit comprises a phase-locked loop; and

the device is configured to apply the second power-supply signal to power said phase-locked loop.

13. The device of claim 12 , wherein:

the digital circuit further comprises a reference oscillator; and

the device is further configured to apply the second power-supply signal to power said reference oscillator.

14. A power-management method, comprising:

applying a first power-supply signal to a processor core;

applying a second power-supply signal to a digital circuit, said second power-supply signal being different from the first power-supply signal; and

reading speed-binning test data that characterize performance of said processor core and said digital circuit from a memory to set one or more levels of said first and second power-supply signals, wherein the processor core, the digital circuit, and the memory are parts of a single integrated circuit.

15. The method of claim 14 , further comprising:

customizing at least one of adaptive power control and dynamic power control for said processor core and said digital circuit using said speed-binning test data.

16. The method of claim 14 , wherein the speed-binning test data has been generated and stored in said memory during production testing of the integrated circuit.

17. The method of claim 16 , wherein the speed-binning test data comprise one or more supply voltages at which the integrated circuit has passed testing employing one or more respective speed-binning test vectors.

18. The method of claim 14 , further comprising:

determining a speed constraint for a task to be executed by the integrated circuit; and

specifying one or more levels of said first power-supply signal for the execution of said task based on said speed constraint and said speed-binning test data.

19. The method of claim 14 , further comprising:

sensing temperature of the processor core; and

specifying the one or more levels of said first power-supply signal based on the sensed temperature.

20. A method of testing an integrated circuit, comprising:

storing in a memory speed-binning test data that characterize performance of the integrated circuit, wherein the integrated circuit comprises:

a processor core configured to receive a first power-supply signal;

a digital circuit configured to receive a second power-supply signal different from the first power-supply signal;

the memory; and

a power controller adapted to:

control the first and second power-supply signals; and

access said speed-binning test data to set one or more levels of said first and second power-supply signals.

21. The method of claim 20 , further comprising:

selecting a speed-binning test vector;

setting the second power-supply signal to a first voltage level;

running the selected speed-binning test vector through the digital circuit at said set voltage level;

determining whether the digital circuit passed a test employing the selected speed-binning test vector at said set voltage level;

if the digital circuit passed said test, setting the selected power-supply signal to a next voltage level; and

repeating the steps of running, determining, and setting to a next voltage level to determine a minimum supply voltage at which the digital circuit is able to pass the test employing the selected speed-binning test vector.

22. The method of claim 20 , wherein the speed-binning test data comprise one or more supply voltages at which the digital circuit has passed testing employing one or more respective speed-binning test vectors.

23. Apparatus, comprising:

a digital processor configured to receive a first power-supply signal;

a digital circuit configured to receive a second power-supply signal, the second power supply signal being different from the first power-supply signal;

a power controller adapted to control the first and second power-supply signals;

a memory adapted to store speed-binning test data that characterize performance of said digital processor and said digital circuit, wherein the power controller is adapted to access said speed-binning test data to set at least one level of each of said first and second power-supply signals.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2009
From: LOPATA, DOUGLAS D.
To: AGERE SYSTEMS INC.
Reel/Frame 022588/0457 →
Continuity (1)
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