Method of manufacturing semiconductor device and substrate processing apparatus
View Patent ↗A manufacturing method of a semiconductor device of the present invention includes the step of forming an insulating film on a substrate, and the step of forming a high dielectric constant insulating film on the insulating film, and the step of forming a titanium aluminum nitride film on the high dielectric constant insulating film, wherein in the step of forming the titanium aluminum nitride film, formation of an aluminum nitride film and formation of a titanium nitride film are alternately repeated, and at that time, the aluminum nitride film is formed firstly and/or lastly.
1. A method of manufacturing a semiconductor device, comprising:
forming an insulating film on a substrate;
forming a high dielectric constant insulating film on the insulating film; and
forming a titanium aluminum nitride film on the high dielectric constant insulating film,
wherein in forming the titanium aluminum nitride film, formation of an aluminum nitride film and formation of a titanium nitride film are alternately repeated, and at that time, the aluminum nitride film is formed firstly and/or lastly.
2. The method of claim 1 , wherein the aluminum nitride film is formed by ALD method, and the titanium nitride film is formed by ALD method or CVD method, and the formation of the aluminum nitride film and the formation of the titanium nitride film are performed in the same processing chamber, with the temperature of the substrate set to be the same temperature.
3. The method of claim 1 , wherein the aluminum nitride film is formed by setting
supplying a source containing aluminum atoms and
supplying gas containing nitrogen atoms
as one cycle, and repeating this cycle multiple number of times, and by changing the number of times of the cycle, concentration of the aluminum atoms in the titanium aluminum nitride film is controlled.
4. The method of claim 1 , wherein the insulating film is a silicon oxide film or a silicon oxynitride film, and the high dielectric constant insulating film is a hafnium silicate nitride film.
5. A method of manufacturing a semiconductor device, comprising
forming an insulating film on a substrate;
forming a high dielectric constant insulating film on the insulating film; and
forming a titanium aluminum nitride film on the high dielectric constant insulating film,
wherein in forming the titanium aluminum nitride film, formation of an aluminum nitride film by ALD method and formation of a titanium nitride film by CVD method are alternately repeated in the same processing chamber, with purging an inside of the processing chamber inserted therebetween, in a state of setting temperature of the substrate to the same temperature, and at that time, the aluminum nitride film is formed firstly and/or lastly.
6. The method of claim 5 , wherein the formation of the aluminum nitride film and the formation of the titanium nitride film are performed in a state of setting a pressure in the processing chamber to the same pressure.
7. The method of claim 5 , wherein the aluminum nitride film is formed by setting
supplying a source containing aluminum atoms and
supplying gas containing nitrogen atoms
as one cycle, and repeating this cycle multiple number of times, and by changing the number of times of the cycle, concentration of the aluminum atoms in the titanium aluminum nitride film is controlled.
8. The method of claim 5 , wherein the insulating film is a silicon oxide film or a silicon oxynitride film, and the high dielectric constant insulating film is a hafnium silicate nitride film.
9. The method of claim 1 , wherein in forming the titanium aluminum nitride film, the aluminum nitride film is formed firstly.
10. The method of claim 1 , wherein in forming the titanium aluminum nitride film, the aluminum nitride film is formed lastly.
11. The method of claim 1 , wherein in forming the titanium aluminum nitride film, the aluminum nitride film is formed firstly and lastly.
12. The method of claim 1 , further comprising applying annealing to the substrate after forming the titanium aluminum nitride film.
13. The method of claim 12 , wherein the annealing is applied to the substrate in a state that a temperature of the substrate is set to a higher temperature than a temperature of the substrate at the time of forming the titanium aluminum nitride film.
14. The method of claim 12 , wherein the annealing is applied to the substrate at a temperature of at least 1000° C.
15. The method of claim 14 , wherein in forming the titanium aluminum nitride film, a temperature of the substrate is set to 250 to 450° C.
16. The method of claim 5 , wherein in forming the titanium aluminum nitride film, a temperature of the substrate is set to 250 to 450° C.
17. The method of claim 16 , wherein in forming the titanium aluminum nitride film, a pressure in the processing chamber is set to 30 to 266 Pa.
18. The method of claim 1 , wherein the high dielectric constant insulating film is formed as a gate insulating film, and the titanium aluminum nitride film is formed as a gate electrode.
19. The method of claim 1 , wherein the insulating film is formed as an interface layer between the substrate and the high dielectric constant insulating film, and the high dielectric constant insulating film is formed as a gate insulating film, and the titanium aluminum nitride film is formed as a gate electrode.
20. A method of manufacturing a semiconductor device, comprising:
forming an insulating film on a substrate, the insulating film containing a silicon oxide film or a silicon oxynitride film;
forming a high dielectric constant gate insulating film on the insulating film;
forming a titanium aluminum nitride film on the high dielectric constant gate insulating film; and
applying annealing to the substrate,
wherein in forming the titanium aluminum nitride film, formation of an aluminum nitride film and formation of a titanium nitride film are alternately repeated, and at that time, the aluminum nitride film is formed firstly and/or lastly.