Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method for selecting wavelength of light for polishing endpoint detection, and polishing endpoint detection method

1. A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection, said method comprising:

polishing a surface of a substrate having a film by a polishing pad;

applying light to the surface of the substrate and receiving reflected light from the substrate during said polishing of the substrate;

calculating relative reflectances of the reflected light at respective wavelengths;

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time;

identifying a point of time when said wavelengths, indicating the local maximum point and the local minimum point, are determined; and

plotting coordinates, specified by said wavelengths and said point of time corresponding to said wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time.

2. The method of producing the diagram according to claim 1 , wherein said determining wavelengths of the reflected light which indicate the local maximum point and the local minimum point comprises:

calculating an average of relative reflectances at each wavelength;

dividing each relative reflectance at each point of time by the average to provide modified relative reflectances for the respective wavelengths; and

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the modified relative reflectances.

3. The method of producing the diagram according to claim 1 , wherein said determining wavelengths of the reflected light which indicate the local maximum point and the local minimum point comprises:

calculating an average of relative reflectances at each wavelength;

subtracting the average from each relative reflectance at each point of time to provide modified relative reflectances for the respective wavelengths; and

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the modified relative reflectances.

4. A method of selecting wavelengths of light for use in optical polishing end point detection, said method comprising:

polishing a surface of a substrate having a film by a polishing pad;

applying light to the surface of the substrate and receiving reflected light from the substrate during said polishing of the substrate;

calculating relative reflectances of the reflected light at respective wavelengths;

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the relative reflectances which vary with a polishing time;

identifying a point of time when said wavelengths, indicating the local maximum point and the local minimum point, are determined;

plotting coordinates, specified by said wavelengths and said point of time corresponding to said wavelengths, onto a coordinate system having coordinate axes indicating wavelength of the light and polishing time to produce a diagram;

searching for coordinates existing in a predetermined time range on the diagram; and

selecting plural wavelengths from wavelengths constituting the coordinates obtained by said searching.

5. The method of selecting the wavelengths according to claim 4 , wherein said selecting plural wavelengths from wavelengths constituting the coordinates obtained by said searching comprises:

with use of the wavelengths constituting the coordinates obtained by said searching, generating plural combinations each comprising plural wavelengths;

calculating a characteristic value, which varies periodically with a change in thickness of the film, from relative reflectances at the plural wavelengths of each combination;

calculating evaluation scores for the plural combinations using a wavelength-evaluation formula; and

selecting plural wavelengths constituting a combination with a highest evaluation score.

6. The method of selecting the wavelengths according to claim 5 , wherein said wavelength-evaluation formula includes, as evaluation factors, a point of time when a local maximum point or a local minimum point of the characteristic value appears and an amplitude of a graph described by the characteristic value with the polishing time.

7. The method of selecting the wavelengths according to claim 4 , further comprising:

performing fine adjustment of the selected plural wavelengths.

8. The method of selecting the wavelengths according to claim 4 , wherein said determining wavelengths of the reflected light which indicate the local maximum point and the local minimum point comprises:

calculating an average of relative reflectances at each wavelength;

dividing each relative reflectance at each point of time by the average to provide modified relative reflectances for the respective wavelengths; and

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the modified relative reflectances.

9. The method of selecting the wavelengths according to claim 4 , wherein said determining wavelengths of the reflected light which indicate the local maximum point and the local minimum point comprises:

calculating an average of relative reflectances at each wavelength;

subtracting the average from each relative reflectance at each point of time to provide modified relative reflectances for the respective wavelengths; and

determining wavelengths of the reflected light which indicate a local maximum point and a local minimum point of the modified relative reflectances.

10. A method of detecting a polishing end point, comprising:

polishing a surface of a substrate having a film by a polishing pad;

applying light to the surface of the substrate and receiving reflected light from the substrate during said polishing of the substrate;

calculating relative reflectances of the reflected light at plural wavelengths selected according to a method as recited in claim 4 ;

from the calculated relative reflectances, calculating a characteristic value which varies periodically with a change in thickness of the film; and

detecting the polishing end point of the substrate by detecting a local maximum point or a local minimum point of the characteristic value that appears during said polishing of the substrate.