Lithographic apparatus and device manufacturing method
View Patent ↗The joint between the projection system element and its support comprises an inorganic layer or a direct bond and is thus liquid tight, which can prevent deformation by an immersion liquid. The joint can be made either warm or cold. Solders, glue, and glue protection can all be used in the formation of this joint. In an embodiment, the elements and its support are made of quartz.
1. A lithographic apparatus comprising:
a substrate table configured to hold a substrate;
a projection system configured to project a patterned beam of radiation onto a target portion of the substrate; and
a liquid supply system configured to at least partially fill a space between the projection system and the substrate table, with a liquid,
wherein a joint between an element of the projection system and its support comprises (i) an inorganic layer and glue protection, the glue protection being applied to protect substantially the entire joint from liquid, or (ii) a direct bond by which molecules of the element and its support chemically interact without using a solder or other material to bond the element to its support, or (iii) both (i) and (ii), and the joint is contacted by liquid when liquid is supplied by the liquid supply system to the space between the projection system and the substrate table.
2. The lithographic apparatus of claim 1 , wherein the joint comprises the inorganic layer and glue protection.
3. The lithographic apparatus of claim 2 , wherein the inorganic layer comprises indium solder.
4. The lithographic apparatus of claim 1 , wherein the joint comprises the direct bond by which molecules of the element and its support chemically interact.
5. The lithographic apparatus of claim 4 , wherein the joint further comprises an inorganic layer comprising (i) a metal layer, (ii) a ceramic layer, (iii) a glass layer, or (iv) any combination selected from (i)-(iii).
6. The lithographic apparatus of claim 5 , wherein the joint further comprises glue protection.
7. The lithographic apparatus of claim 4 , wherein the joint was heat treated to at least 600° C.
8. The lithographic apparatus of claim 1 , wherein the element and its support are made of fused silica.
9. A device manufacturing method, comprising:
projecting a patterned beam of radiation, through a liquid in a space between a projection system and a substrate, onto a target portion of the substrate, wherein a joint between an element of the projection system and its support contacts the liquid and comprises (i) an inorganic layer and glue protection, the glue protection being applied to protect substantially the entire joint from liquid, or (ii) a direct bond by which molecules of the element and its support chemically interact without using a solder or other material to bond the element to its support, or (iii) both (i) and (ii).
10. The method of claim 9 , wherein the joint comprises the inorganic layer and glue protection.
11. The method of claim 10 , wherein the inorganic layer comprises indium solder.
12. The method of claim 9 , wherein the joint comprises the direct bond by which molecules of the element and its support chemically interact.
13. The method of claim 12 , wherein the joint further comprises an inorganic layer comprising (i) a metal layer, (ii) a ceramic layer, (iii) a glass layer, or (iv) any combination selected from (i)-(iii).
14. The method of claim 13 , wherein the joint further comprises glue protection.
15. The method of claim 12 , wherein the joint was heat treated to at least 600° C.