Method for mounting electronic component on printed circuit board
A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
1. A method for mounting an electronic component on a printed circuit board, comprising:
providing a printed circuit board substrate, the printed circuit board substrate including a central main portion and a peripheral unwanted portion;
forming electrically conductive patterns on the main portion;
forming reinforcing patterns on the unwanted portion, wherein a plurality of reinforcing blocks and a plurality of openings are formed in the step of forming reinforcing patterns;
mounting an electronic component on the main portion of the substrate and electrically connecting the electronic component to the electrically conductive patterns, wherein the reinforcing patterns are formed on the unwanted portion prior to mounting the electronic component on the main portion; and
removing the unwanted portion.
2. A method for mounting an electronic component on a printed circuit board, comprising:
providing a printed circuit board substrate, the printed circuit board substrate including a central main portion and a peripheral unwanted portion;
forming electrically conductive patterns on the main portion;
forming reinforcing patterns on the unwanted portion, wherein a plurality of reinforcing grids are formed in the step of forming reinforcing patterns;
mounting an electronic component on the main portion of the substrate and electrically connecting the electronic component to the electrically conductive patterns wherein the reinforcing patterns are formed on the unwanted portion prior to mounting the electronic component on the main portion; and
removing the unwanted portion, wherein the unwanted portion is removed after mounting the electronic component on the main portion of the substrate.