IP Library Granted Patent US 8,044,408
Granted Patent B2
US 8,044,408 · App. 12/469,299 · Granted Oct 25, 2011

SiC single-crystal substrate and method of producing SiC single-crystal substrate

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Quick Facts
Patent No.
US 8,044,408
App. No.
12/469,299
Granted
Oct 25, 2011
Kind
B2
Abstract

The invention provides a high-quality SiC single-crystal substrate, a seed crystal for producing the high-quality SiC single-crystal substrate, and a method of producing the high-quality SiC single-crystal substrate, which enable improvement of device yield and stability. Provided is an SiC single-crystal substrate wherein, when the SiC single-crystal substrate is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 50% or less of all such regions within the substrate surface and the dislocation density in the substrate of dislocations other than the dislocation pairs or dislocation is 8,000/cm 2 .

Claims (9)

1. An SiC single-crystal substrate wherein, when the SiC single-crystal substrate is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 50% or less of all such regions within the substrate surface.

2. An SiC single-crystal substrate wherein, when the SiC single-crystal substrate is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 10% or less of all such regions within the substrate surface.

3. An SiC single-crystal substrate according to claim 1 or 2 , wherein the dislocation density in the substrate of dislocations other than the dislocation pairs or dislocation rows is 8,000/cm 2 or less.

4. An SiC single-crystal substrate according to claim 1 , wherein the polytype of the SiC single-crystal substrate is 4H or 6H.

5. An SiC single-crystal substrate according to claim 1 , wherein the plane direction of the SiC single-crystal substrate is a {0001} plane or a direction inclined within 10° from a {0001} plane.

6. An SiC single-crystal substrate according to claim 1 , wherein the SiC single-crystal substrate is substantially disk-shaped and the disk has a diameter of 60 mm or greater.

7. An SiC single-crystal substrate according to claim 1 , wherein the SiC single-crystal substrate contains nitrogen atoms at the rate of 1×10 18 cm −3 or greater.

8. An SiC single-crystal substrate with an epitaxial film comprising an SiC single-crystal formed with a 3-μm to 30-μm thick epitaxial thin film, wherein, when the thin-film surface of the SiC single-crystal formed with the epitaxial thin film is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 50% or less of all such regions within the substrate surface.

9. An SiC single-crystal substrate with an epitaxial film according to claim 8 , wherein the SiC single-crystal substrate is divided into 5-mm square regions, such regions in which dislocation pairs or dislocation rows having intervals between their dislocation end positions of 5 μm or less are present among the dislocations that have ends at the substrate surface account for 50% or less of all such regions within the substrate surface.

Assignments (6)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
CHANGE OF ADDRESS Recorded Apr 20, 2018
From: NIPPON STEEL CORPORATION
To: NIPPON STEEL CORPORATION
Reel/Frame 045784/0542 →
CHANGE OF NAME Recorded Apr 20, 2018
From: NIPPON STEEL CORPORATION
To: NIPPON STEEL & SUMITOMO METAL CORPORATION
Reel/Frame 045991/0609 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2018
From: NIPPON STEEL & SUMITOMO METAL CORPORATION
To: SHOWA DENKO K.K.
Reel/Frame 045991/0704 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2009
From: FUJIMOTO, TATSUO; TATSUMI, KOHEI; HOSHINO, TAIZO; KATSUNO, MASAKAZU; OHTANI, NOBORU; NAKABAYASHI, MASASHI; TSUGE, HIROSHI; HIRANO, HOUSEI; YASHIRO, HIROKATSU
To: NIPPON STEEL CORPORATION
Reel/Frame 023041/0139 →