SOLID-STATE IMAGER AND METHOD OF MANUFACTURING THE SAME
A solid-state imager including an imaging region, a color filter layer, and an electro-conductive component, wherein the imaging region has a plurality of light receiving elements positioned therein, the plurality of light receiving elements are formed to a substrate, while being arranged in a two-dimensional manner, the color filter layer is formed over and around the imaging region, the electro-conductive component exposes from the color filter layer, the electro-conductive component is positioned around the imaging region but without overlapping the imaging region.
1 . A solid-state imager, comprising:
a substrate;
an imaging region provided to said substrate, and including a plurality of light receiving elements;
a cover layer formed over and around said imaging region; and
an electro-conductive component exposed from said cover layer, and positioned around said imaging region but without overlapping said imaging region, when viewed in the direction normal to said substrate.
2 . The solid-state imager as claimed in claim 1 ,
further comprising a connection component connecting said electro-conductive component to said substrate.
3 . The solid-state imager as claimed in claim 1 ,
wherein said electro-conductive component surrounds a region above said imaging region.
4 . The solid-state imager as claimed in claim 1 ,
further comprising a voltage application unit applying voltage to said electro-conductive component.
5 . The solid-state imager as claimed in claim 1 ,
wherein said electro-conductive component projects out from said cover layer.
6 . The solid-state imager as claimed in claim 1 ,
including a plurality of said electro-conductive components provided along the circumference of said imaging region, while being spaced from each other.
7 . The solid-state imager as claimed in claim 1 ,
wherein said cover layer is a color filter.
8 . A method of manufacturing a solid-state imager, comprising:
forming a plurality of light receiving elements to a substrate;
forming an electro-conductive component over and around said plurality of light receiving elements, but without overlapping said plurality of light receiving elements; and
forming a cover layer over said plurality of light receiving element, so as to allow said electro-conductive component to expose out from said cover layer.