LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME
A lead frame and semiconductor device providing improved bond strength from wave bonding such as of wires in lead frames manufactured with depressed inner leads. The lead frame comprises an outer lead, an inner lead, a step difference section formed between the outer lead and inner lead, and an extended section extending from the inner lead towards the outer lead side. The extended section is provided to be adjacent to the step difference section. An acceptor clamp jig set on the lead frame includes a body, an inner lead support section and extended section support section respectively corresponding to the outer lead, the inner lead and the extended section. The outer lead is pressed from above by a retainer clamp jig. The extended section of the inner lead and the extension support section of the acceptor clamp jig prevent the tip of the inner lead from floating upward by acting together to accept and resist the tensile stress applied on the step difference section of the lead. Ultrasonic waves are in this way applied more efficiently and ultrasonic wave loss in the bond part between the inner lead and the wire is reduced.
1 . A lead frame comprising:
an outer lead;
an inner lead;
a step difference section formed between the outer lead and the inner lead; and
an extended section extending from the inner lead toward the outer lead side and provided to be adjacent to the step difference section.
2 . The lead frame according to claim 1 , wherein
the lead frame comprises a plurality of step difference sections, and
the extended section is sandwiched between two of the plurality of step difference sections.
3 . The lead frame according to claim 1 , wherein
the lead frame comprises a plurality of extended sections, and
the step difference section is sandwiched between two of the plurality of extended sections.
4 . The lead frame according to claim 1 , wherein
the extended section is horizontal relative to the inner lead.
5 . The lead frame according to claim 1 , wherein
the extended section includes a downward extended section, extending further downward from the tip of one extended section to the height of the outer lead bottom surface.
6 . The lead frame according to claim 1 , further comprising:
a semiconductor chip wire-bonded to the inner lead.
7 . The lead frame according to claim 6 , further comprising:
an island,
wherein the semiconductor chip is mounted to the island.
8 . A manufacturing method for lead frame which is mounted a semiconductor chip thereon comprising:
preparing a lead frame including an outer lead, an inner lead, a step difference section formed between the outer lead and the inner lead, and an extended section extending from the inner lead toward the outer lead side to be provided adjacent to the step difference section;
mounting of the lead frame on an acceptor clamp jig, the acceptor clamp jig including a body, an inner lead support piece and an extension support piece respectively corresponding to the outer lead, the inner lead and the extended section;
clamping the outer lead to the body by using the retainer clamp jig;
ultrasonically bonding a wire to the inner lead.