ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

1 . A method of manufacturing an electronic device, the method comprising:

printing a conductive pattern on a first surface of a first green sheet having a multilayer structure, the conductive pattern being electrically connected to an internal interconnection formed in the first green sheet;

superposing a second green sheet on the first surface of the first green sheet, the second green sheet having an opening located in an area corresponding to the conductive pattern;

pressurizing the first green sheet and the second green sheet superposed thereon in directions in which the second green sheet is superposed on the first green sheet;

burning the first green sheet and the second green sheet superimposed thereon to thus form a multilayer ceramic substrate; and

mounting an electronic element on a second surface of the multilayer ceramic substrate opposite to the first surface, the electronic element being electrically connected to the internal interconnection.

2 . The method according to claim 1 , wherein the pressurizing pressurizes the first and second green sheets so that a surface of the conductive pattern is flush with or lower than a surface of the second green sheet in the opening.

3 . The method according to claim 1 , further comprising forming a protection film on the conductive pattern after the burning.

4 . The method according to claim 1 , wherein the mounting the electronic element includes forming a metal layer on the second surface of the multilayer ceramic substrate.

5 . The method according to claim 1 , further comprising:

forming a cavity in a part of the first surface in which the conductive pattern is not formed; and

forming another conductive pattern on a bottom of the cavity so as to be electrically connected to the internal interconnection within the first green sheet.

6 . The method according to claim 5 , further comprising another electronic element on the bottom of the cavity so as to be electrically connected to the internal interconnection.

7 . The method according to claim 1 , wherein the conductive pattern includes a major component of one of Ag, Cu and Ni.

8 . The method according to claim 1 , further comprising dividing the multilayer ceramic substrate into parts.

9 . A wafer comprising:

a multilayer ceramic substrate having an internal interconnection and a surface on which a dent is formed; and

a conductive pattern that is formed on a bottom of the dent and is electrically connected to the internal interconnection, the conductive pattern being a pattern burned together with the multilayer ceramic substrate.

10 . An electronic device comprising:

a multilayer ceramic substrate having an internal interconnection and a first surface on which a dent is formed;

a conducive pattern that is formed on a bottom of the dent and is electrically connected to the internal interconnection, the conductive pattern being a pattern burned together with the multilayer ceramic substrate; and

an electronic element that is provided on a second surface of the multilayer ceramic substrate opposite to the first surface and is electrically connected to the internal interconnection.