UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
Traditional High Speed Electronic Systems Interconnect experience several bandwidth bottlenecks along the multiplicity of signal paths that limits the information throughput. Here we build upon the cellular interconnect concept of PMTL, the Periodic Micro Transmission Line which was introduced in an earlier patent application, and provide a new type of transmission line VMPL, as the Vertical Micro Transmission Line approach to make all the elements of a high speed interconnect wideband, unified, scalable, and practical for high volume manufacturing. This provides total connectivity improvements from end-to-end of electronic systems that demands higher bandwidth, and increased information throughput, thermal management, and impeccable signal integrity. The technologies introduced here provide solutions for any level of the fan out from chips to systems, in CMOS, or Packages, and PCB's.
1 . A multilayer structure for electromagnetic radiation, wave, or signal transmission line, said structure comprising:
one or more dielectric layers or sections;
one or more conducting layers or sections; and
one or more micro-chambers, sandwiched between one or more of following: said one or more dielectric layers or sections, said one or more conducting layers or sections, or both said one or more dielectric layers or sections and said one or more conducting layers or sections.
2 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more metals or conductors.
3 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more insulators.
4 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more dielectrics.
5 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more semiconductors.
6 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise fattened or expanded conductor or metal.
7 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise thinned or narrowed dielectric.
8 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more pockets of air.
9 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more pockets of gas.
10 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more pockets of liquid.
11 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more pockets of fluid.
12 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said one or more micro-chambers comprise one or more pockets of vacuum or low pressure gas.
13 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more ground layers.
14 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more transmission layers.
15 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more via holes or through holes.
16 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more plated via holes or through holes.
17 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more not-plated via holes or through holes.
18 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more Vertical Micro-Transmission Lines.
19 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more empty volumes filled with air, gases, or other materials.
20 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more differential pair units.
21 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more quad pair units.
22 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure substantially cancels noise or increases signal-to-noise ratio.
23 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more combinations, arrays, or stacks of units.
24 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more zig-zag configurations or patterns.
25 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more modular units.
26 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure is matched and connected to a second structure.
27 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more 3-dimensional vias.
28 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure comprises one or more Periodic Micro-Transmission Lines.
29 . The multilayer structure for electromagnetic radiation, wave, or signal transmission line as recited in claim 1 , wherein said structure is a part of a transformer system.