Semiconductor memory device
A plurality of semiconductor memory chips are stacked on a first main surface of a wiring board, and an interposer chip is stacked on the plurality of semiconductor chips, and a semiconductor controller chip is stacked on the interposer chip. The plurality of semiconductor memory chips are independently and electrically connected with inner connecting terminals formed on the wiring board, respectively, and independently controlled by the semiconductor controller chip which is electrically connected with another inner connecting terminals formed on the wiring board via the interposer chip.
1. A semiconductor memory device, comprising:
a wiring board having a first main surface on which first inner connecting terminals and second inner connecting terminals are formed and having a second main surface on which external connecting terminals are formed;
a plurality of semiconductor memory chips which are stacked on the first main surface of the wiring board, each semiconductor memory chip having first electrode pads arranged along at least one outer edge portion thereof on a top surface thereof so that the first electrode pads are electrically connected with the first inner connecting terminals via first wires, respectively;
an interposer chip which is formed on the plurality of semiconductor memory chips and which has second electrode pads arranged along at least one outer edge portion thereof on a top surface thereof and third electrode pads, fourth electrode pads arranged in an inner side thereof on the top surface thereof so that the second electrode pads are electrically connected with the second inner connecting terminals via second wires, respectively;
a semiconductor controller chip which is formed on the interposer chip and which has fifth electrode pads arranged along at least one outer edge portion thereof on a top surface thereof so that the fifth electrode pads are electrically connected with the third electrode pads via third wires, respectively; and
a semiconductor cache memory chip which is formed on the interposer chip.
2. The semiconductor memory device as set forth in claim 1 ,
wherein the semiconductor cache memory chip has sixth electrode pads on a top surface thereof so that the sixth electrode pads are electrically connected with the fourth electrode pads via fourth wires, respectively.
3. The semiconductor memory device as set forth in claim 1 ,
wherein the semiconductor cache memory chip has sixth electrode pads on a top surface thereof so that the sixth electrode pads are electrically connected with the fifth electrode pads via fourth wires, respectively.
4. The semiconductor memory device as set forth in claim 1 ,
wherein the plurality of semiconductor memory chips are configured as NAND flash memory chips or NOR flash memory chips.
5. The semiconductor memory device as set forth in claim 1 ,
wherein the semiconductor cache memory chip is configured as a DRAM chip or a SDRAM chip.
6. The semiconductor memory device as set forth in claim 1 ,
wherein the external connecting terminals includes dummy terminals for heat radiation.