Semiconductor device

1. A semiconductor device comprising:

N (N is an integer equal to or larger than 2) fins made of a semiconductor material aligned in parallel with each other;

a gate electrode formed on both side surfaces of the N fins to cross the fins;

source/drain layers formed in each of the N fins by sandwiching the gate electrode;

a first wiring connected to one of the source/drain layers via a first contact formed in M fins (M is an integer equal to or larger than 2 and equal to or smaller than N); and

a second wiring connected to the other one of the source/drain layers via a second contact formed in K fins (K is an integer smaller than M) and isolated from the first wiring, wherein the first and second contacts are associated with the same gate electrode.

2. The semiconductor device according to claim 1 , further comprising at least one dummy fin aligned in parallel at outside of the N fins.

3. The semiconductor device according to claim 1 , wherein widths of the fins are equal to each other, and intervals between the fins are also equal to each other.

4. The semiconductor device according to claim 1 , wherein the first contact is aligned in the M fins to be symmetrical with each other in the top view plain, and the second contact is aligned in the K fins to be symmetrical with each other in the top view plain.

5. The semiconductor device according to claim 1 , wherein the fins are not doped with impurity.

6. The semiconductor device according to claim 1 , wherein the gate electrode is configured by metal compounds.