IMAGE PICKUP APPARATUS AND ENDOSCOPE
An image pickup apparatus includes a solid-state image pickup device chip, an FPC whose terminals are connected to the solid-state image pickup device chip, and a plurality of electronic components mounted on a front surface of the FPC, wherein behind a back face of the solid-state image pickup chip, the FPC is disposed by being folded in such a way that the FPC will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the plurality of electronic components will be superimposed via the FPC.
1 . An image pickup apparatus comprising:
a solid-state image pickup device chip;
a flexible printed circuit board connected at one end to the solid-state image pickup device chip; and
a plurality of electronic components mounted on one side of the flexible printed circuit board, wherein
behind a back face opposite an image pickup surface of the solid-state image pickup chip, the flexible printed circuit board is disposed by being folded in such a way that the flexible printed circuit board will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the electronic components will be superimposed via the flexible printed circuit board.
2 . The image pickup apparatus according to claim 1 , wherein the flexible printed circuit board provides mounting surfaces for the plurality of electronic components in three or more layers.
3 . The image pickup apparatus according to claim 1 , wherein:
the solid-state image pickup chip makes up a package unit in conjunction with a connecting portion to which the flexible printed circuit board is connected at the one end and cover glass which protects the image pickup surface by being affixed to the image pickup surface; and
the flexible printed circuit board is disposed in such a position as to be superimposed over the package unit when seen in planar view from the image pickup surface.
4 . The image pickup apparatus according to claim 1 , wherein the flexible printed circuit board is disposed by being inclined at a predetermined angle with respect to the back face of the solid-state image pickup chip.
5 . The image pickup apparatus according to claim 1 , wherein the electronic component smaller than a predetermined size is disposed in a region surrounded by the plurality of electronic components equal to or larger than the predetermined size when seen in planar view.
6 . The image pickup apparatus according to claim 1 , wherein the electronic component smaller than a predetermined size is disposed in a region sandwiched by the plurality of electronic components equal to or larger than the predetermined size when seen in planar view.
7 . The image pickup apparatus according to claim 6 , wherein the plurality of electronic components equal to or larger than the predetermined size are disposed in such a way as to sandwich the electronic component smaller than the predetermined size in a direction orthogonal to a folding direction of the flexible printed circuit board, when seen in planar view.
8 . The image pickup apparatus according to claim 1 , wherein a mounting strength enhancement portion is formed in at least part of ends of the flexible printed circuit board in a direction perpendicular to a folding direction of the flexible printed circuit board to enhance mounting strength of the electronic components on the flexible printed circuit board in the folding direction of the flexible printed circuit board.
9 . The image pickup apparatus according to claim 8 , wherein the electronic component smaller than the predetermined size is disposed near the mounting strength enhancement portion.
10 . The image pickup apparatus according to claim 1 , wherein part of the plurality of electronic components is mounted, on one side of the flexible printed circuit board, in a region folded in a second folding direction different from a first folding direction which is the folding direction.
11 . The image pickup apparatus according to claim 1 , wherein a lead wire connecting portion is installed at the other end on either one of the one side of the flexible printed circuit board and the other side opposite the one side in order to be connected with lead wires of a signal cable which transmits an electrical signal of an image picked up on the image pickup surface of the solid-state image pickup chip to an external apparatus.
12 . The image pickup apparatus according to claim 11 , wherein on the folded flexible printed circuit board, the lead wire connecting portion is located in a region separate from a region in which the plurality of electronic components are installed.
13 . The image pickup apparatus according to claim 1 , wherein the flexible printed circuit board has the shape fixed by an adhesive in a folded state.
14 . An endoscope which includes an image pickup apparatus, the image pickup apparatus comprising:
a solid-state image pickup device chip;
a flexible printed circuit board connected at one end to the solid-state image pickup device chip; and
a plurality of electronic components mounted on one side of the flexible printed circuit board, wherein
behind a back face opposite an image pickup surface of the solid-state image pickup chip, the flexible printed circuit board is disposed by being folded in such a way that the flexible printed circuit board will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the electronic components will be superimposed via the flexible printed circuit board.