Method for depositing a layer on a semiconductor wafer by means of CVD and chamber for carrying out the method
View Patent ↗A method for depositing a layer on a semiconductor wafer using chemical vapor deposition (CVD). The method includes providing a chamber having an inlet opening and an outlet opening and a channel joining the inlet opening and the outlet opening, wherein the channel is bounded at the bottom by a plane and at the top by a window transmissive to thermal radiation. A semiconductor wafer is disposed so that a surface of the semiconductor lies in the plane, wherein the window has a center region disposed over the semiconductor wafer and an edge region surrounding the center region and not disposed over the semiconductor wafer. A distance between the plane and the window varies across the chamber, the distance being greater at the edge region than at the center region. A tangent applied to a radial profile of the distance at a boundary between the center region and the edge region forms an angle with the plane of not less than 15° and not more than 25°. A deposition gas is conducted through the channel from the gas inlet opening over the semiconductor wafer to the gas outlet opening, wherein a speed at which the deposition gas is conducted varies over the semiconductor wafer according to the varying distance between the plane and the window.
1. A method for depositing a layer on a semiconductor wafer using chemical vapor deposition (CVD), the method comprising:
providing a chamber having an inlet opening and an outlet opening and a channel joining the inlet opening and the outlet opening, wherein the channel is bounded at the bottom by a plane and at the top by a window transmissive to thermal radiation,
disposing a semiconductor wafer so that a surface of the semiconductor lies in the plane, wherein the window has a center region covering the semiconductor wafer and an edge region disposed outside the center region and not covering the semiconductor wafer, wherein a distance between the plane and the window varies across the chamber, the distance being greater at the edge region than at the center region, and wherein a tangent applied to a radial profile of the distance at a boundary between the center region and the edge region forms an angle with the plane of not less than 15° and not more than 25°; and
conducting a deposition gas through the channel from the gas inlet opening over the semiconductor wafer to the gas outlet opening, wherein a speed at which the deposition gas is conducted varies over the semiconductor wafer according to the varying distance between the plane and the window.
2. The method as recited in claim 1 , wherein the distance between the window and the plane varies across the center region of the window between a maximum center distance and a minimum center distance, and wherein a difference between the maximum center distance and the minimum center distance is not less than 0.5 mm and not more than 2 mm.
3. The method as recited in claim 1 , wherein the distance between the window and the plane varies across the edge region of the window between a maximum edge distance and a minimum edge distance, and wherein a difference between the maximum edge distance and the minimum edge distance is not less than 0.5 mm and not more than 2 mm.
4. The method as recited in claim 1 , wherein the distance varies from 25-35 mm.