METHOD AND DEVICE TO IMPROVE SIGNAL-TO-NOISE RATIO IN HIGH-SPEED OPTICAL DATA COMMUNICATIONS
There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.
1 . An opto-electronic Integrated Circuit Board (ICB) comprising:
a. an ICB substrate;
b. a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector;
c. a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and
d. wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.
2 . The opto-electronic ICB of claim 1 , further comprising a number of trace lines on the ICB substrate, the number of trace lines corresponding to the number of ICB bond pads, wherein each trace line has a proximate end and a distal end, the proximate end being connected to a corresponding ICB bond pad proximate the linear array, and the distal end being connected to an ICB edge bond pad located about an edge of the ICB substrate.
3 . The opto-electronic ICB of claim 2 , wherein a first distance between distal ends of neighbouring trace lines is greater than a second distance between proximate ends of the same neighbouring trace lines.
4 . The opto-electronic ICB of claim 1 , wherein the array of optical fibers comprises an optical fiber ribbon.
5 . The opto-electronic ICB of claim 1 , wherein the one of the VCSEL and the Photodetector is spaced from a neighbouring one of the VCSEL and the Photodetector of a neighbouring cell by a predetermined pitch of about 250 microns.
6 . An opto-electronic Integrated Circuit Board (ICB) adapted to receive a linear array of cells, each one of the cells being for optical connection to an optical fiber, and each one of the cells comprising a die bond pad and one of: a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector, the ICB comprising:
a. an ICB substrate for positioning the linear array thereon;
b. a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells, where each ICB bond pad is for connection, in a one-to-one relationship, to a corresponding die bond pad; and
c. a number of trace lines on the ICB substrate, the number of trace lines corresponding to the number of ICB bond pads, the trace lines each having a proximate end and a distal end, the proximate end being connected to a corresponding one of the ICB bond pads, wherein a first distance between distal ends of neighbouring trace lines is greater than a second distance between proximate ends of the same neighbouring trace lines.
7 . The opto-electronic ICB of claim 6 , wherein the distal end is for connection to a corresponding ICB edge bond pad located about an edge of the ICB substrate.
8 . The opto-electronic ICB of claim 7 , wherein the corresponding ICB edge bond pad is for connection to a corresponding PCB bond pad on a printed circuit board (PCB).
9 . The opto-electronic ICB of claim 8 , wherein the corresponding ICB edge bond pad comprises a VIA connection to the PCB.
10 . The opto-electronic ICB of claim 9 , wherein each transmission line, from the die bond pad to an end connection on one of the PCB and a receiver chip, is impedance matched.
11 . The opto-electronic ICB of claim 6 , wherein one of the ICB bond pads connect to the die bond pad via a wirebond, the wirebond having an inductance-limiting height profile.
12 . The opto-electronic ICB of claim 6 , wherein one of the ICB bond pads connect to the die bond pad via a wirebond, the wirebond defining a loop height, the loop height being based on a proximity of the wirebond to the optical fiber.
13 . An opto-electronic Integrated Circuit Board (ICB) adapted to receive an array of cells for optical connection to an array of optical fibers, each cell comprising a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector, the ICB comprising:
a. an ICB substrate for positioning the array of cells thereon; and
b. ICB bond pads on the ICB substrate, each one of the ICB bond pads for connecting, in a one-to-one relationship, to a corresponding die bond pad of one of the cells, wherein each successive ICB bond pad is located on alternate, opposite sides of the array of cells.
14 . The opto-electronic ICB of claim 13 , further comprising a number of trace lines on the ICB substrate, the number of trace lines corresponding to a number of the ICB bond pads, wherein each one of the trace lines is connected to a corresponding one of the ICB bond pads.
15 . The opto-electronic ICB of claim 13 , wherein the ICB bond pads are equally spaced with respect to one another, and along each one of the alternate, opposite sides of the array.
16 . The opto-electronic ICB of claim 14 , wherein the ICB bond pads each have a rectangular-like shape, a long side of the rectangular-like shape being at substantially 90 degrees with respect to a line which crosses a row of cells in the array.
17 . The opto-electronic ICB of claim 13 , wherein the array comprises an integrated die having a Photodetector array and TransImpendance Amplifier.