SIDE VIEW LIGHT EMITTING DIODE PACKAGE
A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
1 - 12 . (canceled)
13 . A side view light emitting diode package comprising:
a package body having a cavity with an inner sidewall inclined between a bottom and a top;
first and second lead frames arranged in the package body, a portion of each of the first and second lead frames placed in the bottom of the cavity;
a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and
at least one wire for electrically connecting the light emitting diode chip to at least one of the first and second lead frames,
wherein the wire is arranged in such a fashion that a height from a top surface of the light emitting diode chip to a top end of the wire is 100 μm or less; and,
wherein the mounting height of the light emitting diode chip is from 50 μm to 200 μm, and the depth of the cavity is from 200 μm to 480 μm.
14 . The side view light emitting diode package according to claim 13 ,
wherein the wire having one end connected to a bump ball of the lead frame and the other end stitch-bonded to the light emitting diode chip
15 . The side view light emitting diode package according to claim 13 ,
wherein a transparent encapsulant formed in the cavity surrounding the light emitting diode chip and comprising silicone resin.