Patent Assignment
Reel/Frame 026688/0114
Assignment of Assignor's Interest
Recorded: 2011-08-02
Pages: 5
Assignor
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Executed: 2011-08-02
Assignee
SAMSUNG LED CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON,, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(29)
Gallium Nitride-Based Light Emitting Device Having Esd Protection Capacity and Method for Manufacturing the Same
Method of Manufacturing a Vertically-Structured Gan-Based Light Emitting Diode
Light Emitting Diode Package and Fabrication Method Thereof
Vertical Light Emitting Diode and Method of Manufacturing the Same
Light Emitting Diode Package Having Multi-Stepped Reflecting Surface Structure and Fabrication Method Thereof
Method of Fabricating Nitride-Based Compound Layer, Gan Substrate and Vertical Structure Nitride-Based Semiconductor Light Emitting Device
Method of Manufacturing Gallium Nitride Based Light Emitting Diode Having Surface Irregularities
Application:
12/490,891 →
Publication:
US 2009/0258454
Led Package and Backlight Unit Using the Same
Nitride Based Semiconductor Device Using Nanorods and Process for Preparing the Same
Side View Light Emitting Diode Package
Application:
12/510,520 →
Publication:
US 2009/0283792
Nitride Semiconductor Light Emitting Device and Method of Manufacturing the Same
Application:
12/546,896 →
Publication:
US 2009/0315058
Led Package
Manufacturing Method of Light Emitting Diode Package
Light Emitting Diode Module
Application:
12/642,122 →
Publication:
US 2010/0096661
Nitride Semiconductor Single Crystal Substrate, and Methods of Fabricating the Same and a Vertical Nitride Semiconductor Light Emitting Diode Using the Same
Chip Coated Light Emitting Diode Package and Manufacturing Method Thereof
Facet Extraction Led and Method for Manufacturing the Same
Light Emitting Device, Method of Manufacturing the Same and Monolithic Light Emitting Diode Array
Semiconductor Light Emitting Device
Nanowire Light Emitting Device and Method of Manufacturing the Same
Nitride Semiconductor Light Emitting Device and Method of Manufacturing the Same
Light Emitting Device and Package Having the Same for Maximizing Light Emitting Area
Semiconductor Light Emitting Device, Method of Manufacturing the Same, and Semiconductor Light Emitting Device Package Using the Same
Vertical Structure Led Device and Method of Manufacturing the Same
Led Backlight Unit Without Printed Circuit Board and Method of Manufacturing the Same
Nitride Semiconductor Light Emitting Device
Led Package and Backlight Unit Using the Same
Nitride Semiconductor Light Emitting Device
Chip Coated Light Emitting Diode Package and Manufacturing Method Thereof
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Merger
May 2, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028140/0232 →
Merger
Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →