Patent Assignment
Reel/Frame 028140/0232
Merger
Recorded: 2012-05-02
Pages: 9
Assignor
SAMSUNG LED CO., LTD.
Executed: 2012-04-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(14)
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
Patent:
6,372,608 →
Application:
09/051,966 →
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
Method for Fabricating Semiconductor Light Emitting Device
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
Vertical Gan Light Emitting Diode and Method for Manufacturing the Same
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
Vertical Type Nitride Semiconductor Light Emitting Diode
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
Nitride Based Semiconductor Light-Emitting Device
Exfoliating Method, Transferring Method of Thin Film Device, and Thin Film Device, Thin Film Integrated Circuit Device, and Liquid Crystal Display Device Produced by the Same
White Light Emitting Device and White Light Source Module Using the Same
Method of Manufacturing Vertical Light Emitting Diode
Semiconductor Light Emitting Device, Method of Manufacturing the Same, and Semiconductor Light Emitting Device Package Using the Same
Led Package and Backlight Unit Using the Same
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
Assignment of Assignor's Interest
Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →
Assignment of Assignor's Interest
Jan 20, 2011
From: SAMSUNG ELECTRO-MECHANICS CO., LTD
To: SAMSUNG LED CO., LTD
Reel/Frame 025767/0151 →
Assignment of Assignor's Interest
Jan 20, 2011
From: YOO, CHUL HEE; JEONG, YOUNG JUNE; PARK, YOUNG SAM; HAN, SEONG YEON
To: SAMSUNG ELECTRO-MECHANICS CO., LTD
Reel/Frame 025769/0611 →
Corrective Assignment to Correct the Typographical Error in the Assignee's Address Previously Recorded on Reel 025767 Frame 0151. Assignor(S) Hereby Confirms the Entire Right, Title, and Interest in U.S. Patent Application No. 12/081,726.
Mar 1, 2011
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 025879/0531 →
Assignment of Assignor's Interest
Aug 2, 2011
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 026688/0114 →
Assignment of Assignor's Interest
Jan 12, 2012
From: SEIKO EPSON CORPORATION
To: SAMSUNG LED CO., LTD.
Reel/Frame 027524/0837 →