Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same
View Patent ↗There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer.
1. A semiconductor light emitting device comprising:
a first conductivity type semiconductor layer;
an active layer on the first conductivity type semiconductor layer;
a second conductivity type semiconductor layer on the active layer;
a second electrode layer on the second conductivity type semiconductor layer;
an insulating layer on the second electrode layer;
a first electrode layer on the insulting layer; and
a conductive substrate on the first electrode layer,
wherein the second electrode layer has an exposed area at an interface between the second electrode layer and the second conductivity type semiconductor layer, and
the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least a part of the first conductivity type semiconductor layer.
2. The semiconductor light emitting device of claim 1 , further comprising an electrode pad unit formed at the exposed area of the second electrode layer.
3. The semiconductor light emitting device of claim 1 , wherein the exposed area of the second electrode layer is a region exposed by a via hole formed through the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer.
4. The semiconductor light emitting device of claim 3 , wherein the diameter of the via hole increases in a direction from the second electrode layer toward the first conductivity type semiconductor layer.
5. The semiconductor light emitting device of claim 3 , wherein an insulating layer is formed on an inner surface of the via hole.
6. The semiconductor light emitting device of claim 1 , wherein the exposed area of the second electrode layer is formed at the edge of the semiconductor light emitting device.
7. The semiconductor light emitting device of claim 1 , wherein the second electrode layer reflects light generated from the active layer.
8. The semiconductor light emitting device of claim 7 , wherein the second electrode layer comprises one metal selected from a group consisting of Ag, Al, and Pt.
9. The semiconductor light emitting device of claim 1 , wherein an irregular pattern is formed on a surface opposite to another surface of the first conductivity type semiconductor layer forming the interface with the active layer.
10. The semiconductor light emitting device of claim 9 , wherein the irregular pattern has a photonic crystal structure.
11. The semiconductor light emitting device of claim 1 , wherein the conductive substrate comprises one metal selected from a group consisting of Au, Ni, Cu, and W.
12. The semiconductor light emitting device of claim 1 , wherein the conductive substrate comprises one selected from a group consisting of Si, Ge, and GaAs.