Printable thin-film transistors with high dielectric constant gate insulators and methods for producing same
Disclosed are embodiments of organic thin-film transistors (OTFT) with a gate insulator layer comprised of nanocomposites incorporating metal oxide nanoparticles coated by organic ligands and methods of fabricating such OTFTs. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
1. A gated electronic device comprised of:
an organic thin-film transistor (OTFT), wherein the OTFT is further comprised of,
at least one gate insulator layer, wherein the at least one gate insulator layer is comprised of nanocomposites incorporating metal oxide nanoparticles coated by phosphonic acid organic ligands, and
at least one organic semiconductor layer.
2. The gated electronic device of claim 1 , wherein the OTFT is comprised of the at least one organic semiconductor layer deposited on top of a substrate, the at least one gate insulator layer, a gate electrode, a source electrode, and a drain electrode, wherein a voltage applied to the gate electrode changes a density of charge carriers in the organic semiconductor layer and influences current-voltage characteristics measured between the source electrode and the drain electrode.
3. The gated electronic device of claim 2 , wherein the substrate is a conductive substrate comprised of highly doped silicon.
4. The gated electronic device of claim 2 , wherein the substrate is comprised of ITO-coated glass.
5. The gated electronic device of claim 1 , wherein the OTFT is comprised of the at least one organic semiconductor layer deposited on top of a substrate, the at least one gate insulator layer, and a gate electrode, wherein a source electrode, and a drain electrode are deposited on top of the organic semiconductor layer and a voltage applied to the gate electrode changes a density of charge carriers in the organic semiconductor layer will influences current-voltage characteristics measured between the source electrode and the drain electrode.
6. The gated electronic device of claim 5 , wherein the substrate is a conductive substrate comprised of highly doped silicon.
7. The gated electronic device of claim 5 , wherein the substrate is comprised of ITO-coated glass.
8. The gated electronic device of claim 5 , wherein the at least one organic semiconductor layer is pentacene deposited using a thermal evaporator followed by deposition of a film of Au as the source electrode capped with a film of Al as the drain electrode through a shadow mask.
9. The gated electronic device of claim 1 , wherein the at least one gate insulator layer is comprised of a nanocomposite comprised of crosslinkable polymer solution as a host filled with high-κ barium titanate (BaTiO 3 ) nanoparticles (10˜50 nm in diameter) that are coated with a phosphonic acid baring a hydrophilic group {2-[2-(2-methoxyethoxy)ethoxy]ethyl}phosphonic acid (PEGPA).
10. The gated electronic device of claim 9 , wherein the crosslinkable polymer solution is prepared by dissolving a mixture with composition 75:25:5 wt. ratio of poly(4-vinylphenol) (PVP), hexamethoxymethylmelamine, and p-toluene sulfonic acid in 1-buthanol with a concentration of 10 wt. %.
11. The gated electronic device of claim 1 , wherein performance of the OTFT is extracted from the following equation:
I
DS
=
μ
C
ox
W
2
L
(
V
GS
-
V
T
)
2
where μ is the field-effect mobility, C OX is the capacitance density of the gate dielectric [nF/cm 2 ], and V T is the threshold voltage, wherein the OTFT shows a field-effect mobility of 0.04 cm 2 /Vs, a threshold voltage of −2V, a subthreshold slope less than 1 V/decade, and an on/off current ratio of ˜10 5 .
12. The gated electronic device of claim 1 , wherein the at least one gate insulator layer is fabricated using inkjet deposition or printing techniques.
13. The gated electronic device of claim 1 , wherein the at least one organic semiconductor layer is fabricated using inkjet deposition or printing techniques.
14. The gated electronic device of claim 1 , further comprised of a thin capping layer, wherein the thin capping layer is fabricated on top of the at least one gate insulator layer.
15. The gated electronic device of claim 14 , wherein the thin capping layer is comprised of a thin capping layer of PVP.
16. The gated electronic device of claim 1 , wherein the OTFT is fabricated with an inverted structure comprised of one or more source electrodes and one or more drain electrodes substantially fabricated on a substrate, the at least one organic semiconductor layer substantially on top of the one or more source electrodes and the one or more drain electrodes, the at least one gate insulator layer substantially on top of the at least one organic semiconductor layer, and one or more gate electrodes substantially on top of the at least one gate insulator layer.
17. The gated electronic device of claim 1 , wherein the metal oxide nanoparticles coated by organic ligands are comprised of metal oxide nanoparticles having a surface, and phosphonic acid ligands attached to the metal oxide nanoparticle surface.
18. The gated electronic device of claim 17 , wherein the metal oxide nanoparticles coated by organic ligands are comprised of metal oxide nanoparticles having a surface, and ligands attached to the metal oxide nanoparticle surface, wherein the ligands include one or more of residues of phosphonic acids, thiophosphonic acids, dithiophosphonic acids, trithiophosphonic acids, phosphinic acids, thiophosphinic acids, dithiophosphinic acids, phosphohydroxamic acids, and thiophosphohydroxamic acids and derivatives thereof.
19. The gated electronic device of claim 17 , wherein the phosphonic acid ligands attached to the metal oxide nanoparticle surface are comprised of phosphonic acid compounds comprising the structure Gn-R-Xn, wherein G is a terminal group; wherein R is a bridging group; wherein X is a phosphonic acid group having the structure;
wherein each n is, independently, 1, 2, or 3.
20. A method of fabricating an organic thin film transistor comprising:
deposition of at least one organic semiconductor layer substantially on top of a substrate;
deposition of at least one at least one gate insulator layer and a gate electrode substantially on top of the at least one organic semiconductor layer; wherein the at least one gate insulator layer is comprised of nanocomposites incorporating metal oxide nanoparticles coated by phosphonic acid organic ligands; and
deposition a first conductive film as a source electrode capped with a film of a second conductive film as a drain electrode through a shadow mask.
21. The method of claim 20 , wherein deposition a first conductive film as a source electrode capped with a film of a second conductive film as a drain electrode through a shadow mask comprises deposition of a film of Au as the source electrode capped with a film of Al as the drain electrode through a shadow mask.
22. The method of claim 20 , wherein deposition of at least one organic semiconductor layer substantially on top of a substrate comprises deposition of the at least one organic semiconductor layer substantially on top of a conductive substrate comprised of highly doped silicon.
23. The method of claim 20 , wherein deposition of at least one organic semiconductor layer substantially on top of a substrate comprises deposition of the at least one organic semiconductor layer substantially on top of a substrate comprised of ITO-coated glass.
24. The method of claim 20 , wherein deposition of at least one organic semiconductor layer substantially on top of a substrate comprises pentacene deposited using a thermal evaporator substantially on the substrate.
25. The method of claim 20 , wherein deposition of at least one at least one gate insulator layer and a gate electrode substantially on top of the at least one organic semiconductor layer comprises deposition of a nanocomposite comprised of crosslinkable polymer solution as a host filled with high-κ barium titanate (BaTiO 3 ) nanoparticles (10˜50 nm in diameter) that are coated with a phosphonic acid baring a hydrophilic group {2-[2-(2-methoxyethoxy)ethoxy]ethyl}phosphonic acid (PEGPA).
26. The method of claim 25 , wherein the crosslinkable polymer solution is prepared by dissolving a mixture with composition 75:25:5 wt. ratio of poly(4-vinylphenol) (PVP), hexamethoxymethylmelamine, and p-toluene sulfonic acid in 1-buthanol with a concentration of 10 wt. %.
27. The method of claim 20 , wherein deposition of the at least one gate insulator layer is comprised of depositing the at least one gate insulator layer using inkjet deposition or printing techniques.
28. The method of claim 20 , wherein deposition of the at least one organic semiconductor layer comprises depositing the at least one organic semiconductor layer using inkjet deposition or printing techniques.
29. The method of claim 20 , further comprising depositing a thin capping layer on top of the at least one gate insulator layer.
30. The method of claim 20 , wherein depositing a thin capping layer on top of the at least one gate insulator layer comprises depositing a thin capping layer of PVP on top of the at least one gate insulator layer.