Sample support structure and methods
A sample support structure comprising a sample support manufactured from a semiconductor material and having one or more openings therein. Methods of making and using the sample support structure.
1. A sample support structure comprising (i) a sample support comprising silicon carbide and having one or more holes therein, and (ii) a base underlying the sample support comprising an opening therein substantially surrounding the one or more holes of the sample support, wherein the thickness of the sample support is about 100 to 5000 Angstroms, and wherein the silicon carbide is doped to achieve a resistivity of less than about 10 ohm-cm.
2. The sample support structure of claim 1 wherein the sample support comprises at least one array of holes therein.
3. The sample support structure of claim 1 wherein the one or more holes in the sample support have a diameter ranging from about 0.5 to about 4 μm.
4. The sample support structure of claim 1 wherein the silicon carbide is doped with nitrogen.
5. The sample support structure of claim 1 wherein the base comprises a second material selected from the group consisting of monocrystalline silicon, polycrystalline silicon, amorphous silicon, alumina, quartz, fused silica, boron nitride, silicon carbide, metals, ceramics, and conducting oxides.
6. The sample support structure of claim 1 wherein the base:
(a) has a shape which substantially tracks the perimeter of the sample support; and/or
(b) comprises an opening therein, the perimeter of which substantially tracks the perimeter of the one or more array of holes in the sample support.
7. The sample support structure of claim 1 wherein:
(a) the sample support comprises an array of holes therein; and
(b) the base comprises a single opening substantially surrounding the array of holes.
8. A method of making a sample support structure, comprising the steps of:
(a) providing a substrate comprising three layers:
(i) a top base layer comprising an etchable base material;
(ii) a middle insulator layer comprising an etchable insulator material; and
(iii) a bottom substrate layer comprising an etchable substrate material;
(b) applying a sample support layer comprising silicon carbide to the top base layer;
(c) patterning dimensions of a sample support onto the sample support layer, wherein the dimensions include one or more holes;
(d) etching the sample support layer to achieve dimensions established by the patterning step, including the one or more holes;
(e) etching the base layer to achieve dimensions of a base;
(f) etching the insulator layer to release or substantially release the insulator layer, thereby freeing or substantially freeing the bottom substrate layer from a sample support structure comprising:
(i) a sample support comprising silicon carbide and having one or more holes therein; and
(ii) a base underlying the sample support comprising an opening therein substantially surrounding the one or more holes of the sample support,
wherein the thickness of the sample support is about 100 to 5000 Angstroms, and wherein the silicon carbide is doped to achieve a resistivity of less than about 10 ohm-cm.
9. The method of claim 8 wherein the silicon carbide is doped with nitrogen.
10. The method of claim 8 wherein the base layer comprises a material selected from a group consisting of monocrystalline silicon, polycrystalline silicon, amorphous silicon, alumina, quartz, fused silica, boron nitride, silicon carbide, metals, ceramics, and conducting oxides.
11. The method of claim 8 wherein the bottom substrate layer comprises a material selected from a group consisting of monocrystalline silicon, polycrystalline silicon, amorphous silicon, alumina, quartz, fused silica, boron nitride, silicon carbide, other semiconductor materials, metals, ceramics, and conducting oxide.
12. The method of claim 8 wherein the insulator layer comprises a material selected from a group consisting of silicon dioxide, fused silica, quartz, aluminum nitride, conducting oxides, and silicon monoxide.
13. The method of claim 8 wherein step (d) comprises etching the sample support layer using a technique selected from the group consisting of wet chemical etching, reactive ion etching (RIE), deep reactive ion etching (DRIE), and ion milling.
14. The method of claim 8 wherein step (c) comprises patterning at least one array of holes in a center portion of the sample support layer.
15. The method of claim 8 , wherein the base layer is etched using wet chemical etching, or reactive ion etching followed by wet chemical etching, or deep reactive ion etching followed by wet chemical etching.
16. The method of claim 8 , wherein the insulator layer is etched using wet chemical etching.
17. The method of claim 8 wherein the base layer of the substrate is etched using a deep reactive ion etching technique.
18. The method of claim 8 wherein step (e) comprises:
(a) a first step comprising deep reactive ion etching; and
(b) a second step comprising solution comprising hydrofluoric acid, nitric acid, and acetic acid (HNA).
19. The sample support structure of claim 1 , wherein the thickness of the sample support is about 200 to about 1000 Angstroms.
20. The method of claim 8 , wherein the base layer is etched via the one or more holes in the sample support layer.