Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method
A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water.
1. A material for forming electroless plate comprising a non-conductive base material, a catalyst adhering layer provided on the non-conductive base material, wherein the catalyst adhering layer is free of catalyst and comprises a water-insoluble polyester resin, wherein a surface of the catalyst adhering layer, opposite the non-conductive base material, shows a contact angle of 60° or smaller to purified water, and a particulate metal catalyst adhered to the surface of the catalytic adhering layer, wherein the water-insoluble polyester resin is a self-crosslinkable polyester resin.
2. The material for forming electroless plate according to claim 1 , wherein the catalyst adhering layer contains the polyester resin in an amount of 50% by weight or more of the total resin constituting the catalyst adhering layer.
3. The material for forming electroless plate according to claim 1 wherein the water-insoluble polyester resin has a hydroxyl value of 10-400 mg KOH/g.
4. The material for forming electroless plate according to claim 3 , wherein the catalyst adhering layer contains the polyester resin in an amount of 50% by weight or more of the total resin constituting the catalyst adhering layer.