HIGH VOLTAGE RECESSED CONNECTOR CONTACT
A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.
1 . An over-molded printed circuit board (PCB) with an integrated poke-home connector comprising:
(a) a deeply recessed high voltage connector contact, having a conductive rubber slug and a thin membrane over said recessed conductive rubber slug
whereby said recessed high voltage connector contact forms an arc and leakage resistant connection point.
2 . An over-molded printed circuit board (PCB) with an integrated poke-home connector comprising:
(a) a low pressure over-molded encapsulation potting a high voltage multiplier PCB with an integrated high voltage transformer;
(b) a deeply recessed high voltage connector contact, having a conductive rubber slug and a thin membrane over said recessed conductive rubber slug;
(c) slots cut into the PCB to allow for standard surface mounting techniques for mounting components onto the PCB; and
(d) components selected for their use in current mode (CM) output control of the high voltage output curves slope;
whereby the over-molded PCB with an integrated poke-home connector can safely and efficiently deliver high voltage to an object inserted into said deeply recessed high voltage connector contact.
3 . A method for making the over-molded PCB with an entegrated poke-home connector, constructed in accordance with claim 1 , comprising the steps of:
a) providing a low pressure over-molded encapsulation potting of a high voltage multiplier PCB with an integrated high voltage transformer;
b) providing a deeply recessed high voltage connector contact, having a conductive rubber slug and a thin membrane over said recessed conductive rubber slug;
c) cutting slots into the PCB to allow for standard surface mounting techniques for mounting components onto the PCB; and
d) selecting components for their use in current mode (CM) output control of the high voltage output curve slope;
whereby the over-molded PCB with an integrated poke-home connector can safely and efficiently deliver high voltage to an object inserted into said deeply recessed high voltage connector contact.
4 . An over-molded printed circuit board (PCB) with an integrated poke-home connector according to claim 1 , further comprising:
(a) a plurality of integrated current mode control components;
(b) a low pressure over-molded encapsulation potting said plurality of components mounted on a high voltage PCB; and
(c) a deeply recessed high voltage connector contact affixed to said PCB, having a conductive rubber slug and a thin membrane over said recessed conductive rubber slug;
whereby said recessed high voltage connector contact forms an arc and leakage resistant connection point.
5 . The PCB according to claim 1 , further comprising:
a metal saddle electrically connected to said PCB;
wherein said recessed conductive rubber plug is electrically connected to said metal saddle.
6 . The PCB according to claim 1 , further comprising:
slots cut into said PCB to allow for standard surface mounting techniques for mounting said plurality of components onto said PCB.
7 . The PCB according to claim 6 , wherein at least one of said plurality of components further comprise axially mounted components.
8 . The PCB according to claim 1 , further comprising:
cavities cut into said PCB to allow for standard surface mounting techniques for mounting said plurality of components onto said PCB.
9 . The PCB according to claim 8 , wherein at least one of said plurality of components further comprise large surface area components.
10 . The PCB according to claim 1 , further comprising:
channels cut into said PCB to allow the encapsulation material to fill said channels breaking the conduction path along the surface of said PCB between said plurality of components.
11 . The PCB according to claim 1 , wherein at least one of said plurality of components is a high voltage component.
12 . The PCB according to claim 11 , wherein the high voltage component is high voltage multiplier with an early voltage sensing divider.
13 . The PCB according to claim 1 , wherein at least one of said plurality of components may be used for current mode (CM) output control of the high voltage output curve slope.
14 . A method for making an over-molded PCB with an integrated poke-home connector, comprising the steps of:
(a) providing a printed circuit board (PCB);
(b) cutting a plurality of openings in said PCB;
(c) providing a plurality of components;
(d) mounting said plurality of components in said plurality of openings;
(e) providing an arc and leakage resistant connection point; and
(f) encapsulating said components and said PCB by means of a low pressure injection molding;
whereby the part is fully encapsulated and has maintained overall minimum width.
15 . The method for making an over-molded PCB with an integrated poke-home connector according to claim 14 , wherein the step of providing said arc and leakage resistant connection point further comprises the step of providing a deeply recessed high voltage connector contact affixed to said PCB, having a conductive rubber slug and a thin membrane over said recessed conductive rubber slug.
16 . The method for making an over-molded PCB with an integrated poke-home connector according to claim 15 , further comprising the step of:
providing a metal saddle electrically connected to said PCB;
wherein said recessed conductive rubber plug is electrically connected to said metal saddle.
17 . The method for making an over-molded PCB with an integrated poke-home connector according to claim 14 , wherein the plurality of holes in the PCB further comprise channels in said PCB to allow the encapsulation material to fill said channels breaking the conduction path along the surface of said PCB between said plurality of components.