Low pressure molding encapsulation of high voltage circuitry
A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.
1. A process for making an over-molded PCB with an integrated poke-home connector, comprising the steps of:
providing a printed circuit board (PCB);
cutting a plurality of openings in said. PCB;
providing a plurality of components;
mounting said plurality of components in said plurality of openings;
encapsulating said components and said PCB by means of a low pressure injection molding;
providing an integrated poke-home connector comprising: a recessed high voltage connector contact affixed to said PCB, said recessed high voltage connector contact having a conductive rubber slug and a thin membrane over said conductive rubber slug;
providing a metal saddle electrically connected to the PCB; and
wherein said conductive rubber plug is electrically connected to said metal saddle.
2. The process for making an over-molded PCB with an integrated poke-home connector according to claim 1 ,
wherein said recessed high voltage connector contact forms an arc resistant connection point.
3. The process for making an over-molded PCB with an integrated poke-home connector according to claim 2 , further comprising the step of:
providing said thin membrane over said recessed conductive rubber slug which may be pierced by an insulated “male” high voltage connector with a sharp point to complete an electrical connection.
4. The process for making an over-molded PCB with an integrated poke-home connector according to claim 2 , further comprising the step of:
providing said thin membrane over said recessed conductive rubber slug which is a self-resealing membrane once said insulated “male” high voltage connector with a sharp point is removed.
5. The process for making an over-molded PCB with an integrated poke-home connector according to claim 1 , wherein said openings further comprise slots further comprising the steps of:
providing axially mounted components; and
mounting said axially mounted in said slots.
6. The process for making an over-molded PCB with an integrated poke-borne connector according to claim 1 , wherein said openings further comprise cavities further comprising the steps of:
providing large surface area components; and
mounting said large surface area components in said cavities.
7. The process for making an over-molded PCB with an integrated poke-home connector according to claim 1 , further comprising the step of: cutting channels into said PCB to isolate said plurality of components.
8. The process for making an over-molded PCB with an integrated poke-home connector according to claim 7 , further comprising the step of:
injecting low-pressure mold encapsulation material in said channels to break conductivity pathways between said plurality of components.
9. The process for making an over-molded PCB with an integrated poke-home connector according to claim 1 , further comprising the step of:
providing at least one of said plurality of components to be a high voltage component.
10. The process for making an over-molded PCB with an integrated poke-home connector according to claim 1 , further comprising the step of: providing at least one of said plurality of components for their use in current mode (CM) output control of the high voltage output curve slope.