Resin composition for encapsulating an electronic tag, a resin-encapsulated electronic tag and a method for producing the same
A resin composition for encapsulating an electronic tag which includes a thermoplastic resin and a flat glass fiber and does not include a thermoplastic elastomer, wherein the thermoplastic resin is at least one selected from polycarbonate, syndiotactic polystyrene and polyphenylene sulfide.
1. A resin composition which comprises a thermoplastic resin and a flat glass fiber and does not comprise a thermoplastic elastomer, wherein the thermoplastic resin is polyphenylene sulfide and the crystallization temperature during cooling thereof measured by differential scanning calorimetry (DSC) is 230° C. -240° C.
2. The resin composition according to claim 1 , comprising 100 parts by mass of the thermoplastic resin, 10 to 200 parts by mass of the flat glass fiber and further comprising 0 to 200 parts by mass of an inorganic filler.
3. The resin composition according to claim 1 , wherein the oblateness (the short axis/the major axis of a cross section) of the flat glass fiber is ½ to 1/10.
4. The resin composition according to claim 2 , wherein the inorganic filler is at least one of calcium carbonate, mica, talc and silica and is present in 50 to 200 parts by mass.
5. An electronic tag which comprises the resin composition according to claim 1 and an electronic tag inlet.
6. A method for producing an electronic tag comprising:
molding the resin composition according to claim 1 to form a primary molded product;
combining an electronic tag inlet with the primary molded product; and
encapsulating the electronic tag inlet with the resin composition.
7. The resin composition according to claim 2 , comprising 100 parts by mass of the thermoplastic resin, 40 to 100 parts by mass of the flat glass fiber, and 50 to 170 parts by mass of an inorganic filler.
8. The resin composition according to claim 7 , wherein the oblateness (the short axis/the major axis of a cross section) of the flat glass fiber is ½ to 1/10.
9. The resin composition according to claim 8 , wherein the inorganic filler is at least one of calcium carbonate, mica, talc and silica.
10. The resin composition according to claim 1 , comprising 100 parts by mass of the thermoplastic resin, 40 to 100 parts by mass of the flat glass fiber and further comprising 50 to 200 parts by mass of an inorganic filler.
11. The resin composition according to claim 10 , comprising 50 to 170 parts by mass of said inorganic filler.
12. The resin composition according to claim 4 , wherein the inorganic filler is calcium carbonate.
13. The resin composition according to claim 7 , wherein the inorganic filler is calcium carbonate.
14. The resin composition according to claim 10 , wherein the inorganic filler is calcium carbonate.
15. The resin composition according to claim 11 , wherein the inorganic filler is calcium carbonate.