IP Library Granted Patent US 8,274,047
Granted Patent B2
US 8,274,047 · App. 12/537,414 · Granted Sep 25, 2012

Substrate surface inspection method and inspection apparatus

Assignees: Ebara Corporation; Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,274,047
App. No.
12/537,414
Granted
Sep 25, 2012
Kind
B2
Abstract

A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a contrast between at least two types of materials of the plurality of materials is within a predetermined range; detecting electrons generated by the substrate to acquire a surface image of the substrate, with a pattern formed thereon from the at least two types of materials eliminated or weakened; and detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image in the surface image. Defects present on the substrate surface can be detected easily and precisely by using a cell inspection.

Claims (15)

1. A method for inspecting for a defect on a substrate including a plurality of materials on a surface thereof, the method comprising:

setting a landing energy of an electron beam based on at least two type of materials of the plurality of materials so that a pattern formed on the surface image of the substrate from the at least two types of materials can be eliminated or weakened;

irradiating the surface of the substrate with electron beam;

detecting electrons generated by the substrate to acquire a surface image of the substrate; and

detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image which is consisted of the eliminated of weakened image of two types of materials.

2. The method according to claim 1 , wherein the contrast between the background image and the defect is three times or more the contrast between the at least two types of materials.

3. The method according to claim 1 , including a pre-irradiation process before the electron beam irradiation process, wherein the pre-irradiation process comprises irradiating at least once with an electron beam whose landing energy is different from that in the electron beam irradiation process.

4. The method according to claim 3 , wherein the pre-irradiation process comprises irradiating a plurality of times with the electron beam, the landing energy of which is varied for the plurality of times of irradiations.

5. The method according to claim 1 , wherein the landing energy of the electron beam of the electron beam irradiation process is 1 eV or more but not exceeding 50 eV.

6. The method according to claim 1 , wherein the substrate is a reticle.

7. The method according to claim 1 , wherein the defect includes a foreign material.

8. An apparatus for inspecting for a defect on a substrate including a plurality of materials on a surface thereof, the substrate surface inspection apparatus comprising:

an electron gun for irradiating the surface of the substrate with an electron beam wherein a landing energy of the electron beam is set so that a pattern formed on the surface image of the substrate from the at least two types of materials can be eliminated or weakened;

an imaging device for detecting electrons generated by the substrate to acquire a surface image of the substrate; and

an arithmetic processor for detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image which is consisted of the eliminated or weakened image of two types of materials.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2024
From: KIOXIA CORPORATION
To: EBARA CORPORATION
Reel/Frame 068504/0705 →
CHANGE OF NAME Recorded Dec 23, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058573/0535 →
MERGER Recorded Dec 23, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 058573/0542 →
CHANGE OF NAME Recorded Dec 23, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058573/0657 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043546/0955 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNEE'S ADDRESS TO 11-1, HANEDA ASAHI-CHO, OHTA-KU TOKYO, JAPAN 144-8510 PREVIOUSLY RECORDED ON REEL 023087 FRAME 0231. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 20, 2009
From: NAITO, YOSHIHIKO; KIMURA, NORIO; TERAO, KENJI; HATAKEYAMA, MASAHIRO; ITOH, MASAMITSU
To: EBARA CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 023123/0939 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2009
From: NAITO, YOSHIHIKO; KIMURA, NORIO; TERAO, KENJI; HATAKEYAMA, MASAHIRO; ITOH, MASAMITSU
To: EBARA CORPORATION; KABUSHIKI KAISHA TOSHIBA
Reel/Frame 023087/0231 →
Priority Claims (1)
JP 2008-205097 · Aug 8, 2008 · national
Continuity (1)
Related Publication 20100032566A1 · Feb 11, 2010