IP Library › Granted Patent US 8,671,875
Granted Patent B2
US 8,671,875 · App. 12/540,219 · Granted Mar 18, 2014

Liquid processing apparatus, liquid processing method and storage medium

Inventors: Shuichi Nagamine (Koshi, JP); Naofumi Kishita (Koshi, JP); Satoshi Biwa (Koshi, JP); Kouji Fujimura (Koshi, JP)
Assignee: Tokyo Electron Limited
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Quick Facts
Patent No.
US 8,671,875
App. No.
12/540,219
Granted
Mar 18, 2014
Kind
B2
Abstract

Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E 1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E 2 less than the first amount E 1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E−E 1 )/(n−1).

Claims (18)

1. A liquid processing apparatus comprising:

n-number of substrate retainers arranged in parallel to each other in a common case, n being an integer identical to or greater than three, each of circumferences of the substrate retainers being surrounded with a cup body;

a common chemical liquid nozzle configured to be movable along an arrangement direction of the substrate retainers and to sequentially apply a chemical photoresist liquid to substrates retained in the substrate retainers;

n-number of cleaning nozzles, each being dedicated to one of the substrate retainers, supplying a cleaning solvent to the substrates after application of the chemical photoresist liquid by the chemical liquid nozzle;

a plurality of separate exhaustion passages each connected to a corresponding cup body, each separate exhaustion passage being equipped with a branched passage open to the common case;

a common exhaustion passage connected downstream of the separate exhaustion passages, inner atmosphere of the common exhaustion passage being inhaled and exhausted with a total exhaust amount E;

a first controller connected to each of the separate exhaustion passages and configured to control the intake amount of external air from the corresponding cup body and from a corresponding branched passage; and

a control part configured to generate a control signal setting the first controller,

wherein in a first mode where the common chemical liquid nozzle is located at a setting location facing the substrate retained in the corresponding substrate retainer for one cup body, the first controller for said one cup body receives the external air only from said one cup body in a first intake amount E 1 , while the first controller for each of the remaining cup bodies receives the external air not only from each said remaining cup body in a second intake amount E 2 , with E 2 being less than E 1 , but also receives air from the corresponding branched passage for each said remaining cup body, so that the total exhaust amount E will remain constant;

wherein in a second mode where the common chemical liquid nozzle is not located at a setting location facing the substrate on the corresponding substrate retainer for any cup body, the first controller for each cup body receives the external air not only from each cup body in the second intake amount E 2 , but also receives air from the corresponding branched passage for each cup body, so that the total exhaust amount E will remain constant,

wherein the common exhaustion passage comprises one end directly open in the common case, and a second controller for the intake amount of external air to control the intake amount of external air entering the common exhaustion passage, and

wherein the control part is configured to change the intake amount of external air by the second controller between when the chemical liquid nozzle is placed at the setting location for the one cup body and when the chemical liquid nozzle is not placed at the setting location for any of the cup bodies.

2. The apparatus of claim 1 , wherein the control part controls the second controller such that the external air is not received in the common exhaustion passage when the chemical liquid nozzle is placed at the setting location for the one cup body, and the external air is received in the common exhaustion passage when the chemical liquid nozzle is not placed at the setting location for any of the cup bodies.

3. The apparatus of claim 1 , wherein the first controller is a damper.

4. The apparatus of claim 1 , wherein the second controller is a damper.

5. The apparatus of claim 1 , wherein the number of the substrate retainers is not less than 3 but not more than 6 (3≦n≦6).

6. The liquid processing apparatus of claim 1 , wherein a first condition is defined as a state where the external air is not inhaled from the common exhaustion passage.

7. The liquid processing apparatus of claim 1 , wherein a second condition is defined as a state where the external air is inhaled from the common exhaustion passage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2009
From: NAGAMINE, SHUICHI; KISHITA, NAOFUMI; BIWA, SATOSHI; FUJIMURA, KOUJI
To: TOKYO ELECTRON LIMITED
Reel/Frame 023096/0688 →
Priority Claims (1)
JP 2008-208093 · Aug 12, 2008 · national
Continuity (1)
Related Publication 20100040779A1 · Feb 18, 2010