Embedding device in substrate cavity
View Patent ↗An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness matches the depth such that the device surface is approximately planar with the substrate surface. The first device is attached to a second device via bumps on the second device.
1. An apparatus comprising:
a substrate having a cavity and a substrate surface, the cavity having a depth;
a first device having contact pads on a device surface and a thickness placed inside the cavity, the thickness matching the depth such that the device surface is approximately planar with the substrate surface; and
a second device directly attached to the substrate surface and the contact pads on the device surface of the first device via a first plurality of bumps on the second device.
2. The apparatus of claim 1 wherein the first device is surrounded by solder resist.
3. The apparatus of claim 2 wherein the first device has device solder bumps on the solder resist on top of the device surface.
4. The apparatus of claim 1 wherein the second device is attached to the substrate surface via a second plurality of bumps on the second device.
5. The apparatus of claim 1 wherein the first device is a memory device and the second device is a processor.
6. A system comprising:
a front end processing unit to convert a radio frequency (RF) signal to an intermediate frequency (IF) signal;
an IF processing unit coupled to the front end processing unit to convert the IF signal to an base-band signal; and
a base-band processing unit coupled to the IF processing unit to convert the base-band signal to digital data, the base-band processing unit having a circuit board, the circuit board having components to process the digital data, the circuit board comprising:
a substrate having a cavity and a substrate surface, the cavity having a depth,
a first device having contact pads on a device surface and a thickness placed inside the cavity, the thickness matching the depth such that the device surface is approximately planar with the substrate surface, and
a second device directly attached to the contact pads on the device surface of the first device via a first plurality of bumps on the second device.
7. The system of claim 6 wherein the first device is surrounded by solder resist.
8. The system of claim 7 wherein the first device has solder bumps on the solder resist on top of the device surface.
9. The system of claim 6 wherein the second device is attached to the surface substrate via a second plurality of bumps on the second device.
10. The system of claim 6 wherein the first device is a memory device and the second device is a processor.
11. The apparatus of claim 1 further comprises:
solder resist around the first device and inside the cavity to provide support and sealing for the first device.
12. The apparatus of claim 3 wherein the substrate has substrate solder bumps on the substrate surface.
13. The apparatus of claim 12 wherein the device solder bumps and the substrate solder bumps are planar.
14. The system of claim 6 wherein the circuit board further comprises:
solder resist around the first device and inside the cavity to provide support and sealing for the first device.