IP Library Granted Patent US 8,106,671
Granted Patent B2
US 8,106,671 · App. 12/541,058 · Granted Jan 31, 2012

Socketless integrated circuit contact connector

Assignee: Applied Micro Circuits Corporation
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Quick Facts
Patent No.
US 8,106,671
App. No.
12/541,058
Granted
Jan 31, 2012
Kind
B2
Abstract

A socketless integrated circuit (IC) contact connector is provided with an electrically conductive support post. An electrically conductive spring has a first end connected to the post, and a second end. An electrically conductive first wire has a first end connected to the spring second end, and a second end. An electrically conductive loop with a loop neck is connected to the first wire second end. Typically, the loop is formed in the first wire second end. The spring and loop work in cooperation to engage an IC contact.

Claims (40)

1. A socket less integrated circuit (IC) contact connector comprising:

an electrically conductive support post;

an electrically conductive spring having a first end connected to the post, and a second end;

an electrically conductive first wire having a first end connected to the spring second end, and a second end;

an electrically conductive second wire having a first end connected to the spring second end, and a second end connected to the post;

an electrically conductive loop with a loop neck connected to the first wire second end; and,

wherein the spring and loop work in cooperation to engage an IC contact.

2. The connector of claim 1 where the loop is formed by the first wire.

3. The connector of claim 1 further comprising:

an electrical insulating sleeve overlying the first wire.

4. The connector of claim 1 wherein the loop has a diameter greater than an engaged ball grid array (BGA) IC contact diameter.

5. The connector of claim 4 wherein the loop is a wire having a wire diameter less than the BGA diameter.

6. The connector of claim 5 wherein the first wire forms a loop diameter in a range between 10 and 30 mils; and,

wherein the first wire has a diameter of about 6 mils.

7. The connector of claim 1 wherein the spring has a first electrical resistance; and,

wherein the second wire has a second electrical resistance less than the first resistance.

8. The connector of claim 7 wherein the spring has an extension length when the loop is engaged with the IC contact; and,

wherein the second wire has a length greater than the spring extension length.

9. A universal socketless integrated circuit (IC) test fixture with a contact connector, the test fixture comprising:

probing platform to accept an IC, the IC having electrical contacts formed on a bottom surface in an array of m rows, where each row includes n, or less contacts;

a probe arm including p probe pins, where p is greater than, or equal to n;

a clamping mechanism to mechanically interface the probe arm probe pins to a row of n IC contacts under test;

an electrically conductive support post;

an electrically conductive spring having a first end connected to the post, and a second end;

an electrically conductive first wire having a first end connected to the spring second end, and a second end;

an electrically conductive second wire having a first end connected to the spring second end, and a second end connected to the post;

an electrically conductive loop with a loop neck connected to the first wire second end;

wherein the probe arm, clamping mechanism, and probe platform work in cooperation to electrically interface a first row of IC contacts; and,

wherein the spring and loop work in cooperation to engage a single IC contact in a second row of IC contacts.

10. The test fixture of claim 9 where the loop is formed by the first wire.

11. The test fixture of claim 9 further comprising:

an electrical insulating sleeve overlying the first wire.

12. The test fixture of claim 10 wherein the loop has a diameter greater than an engaged ball grid array (BC-A) IC contact diameter.

13. The test fixture of claim 12 wherein the loop is a wire having a wire diameter less than the BCA diameter.

14. The test fixture of claim 13 wherein the first wire forms a loop diameter in a range between 10 and 30 mils; and,

wherein the first wire has a diameter of about 6 mils.

15. The test fixture of claim 10 wherein the spring has a first electrical resistance; and,

wherein the second wire has a second electrical resistance less than the first resistance.

16. The test fixture of claim 15 wherein the spring has an extension length when the loop is engaged with the IC contact; and,

wherein the second wire has a length greater than the spring extension length.

Assignments (3)
SECURITY INTEREST Recorded May 11, 2017
From: MACOM CONNECTIVITY SOLUTIONS, LLC (SUCCESSOR TO APPLIED MICRO CIRCUITS CORPORATION)
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 042444/0891 →
MERGER AND CHANGE OF NAME Recorded May 8, 2017
From: APPLIED MICRO CIRCUITS CORPORATION; MACOM CONNECTIVITY SOLUTIONS, LLC
To: MACOM CONNECTIVITY SOLUTIONS, LLC
Reel/Frame 042423/0700 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2009
From: PATTERSON, JOSEPH MARTIN
To: APPLIED MICRO CIRCUITS CORPORATION
Reel/Frame 023099/0090 →
Continuity (2)
Continuation In Part 12535533 · Aug 4, 2009
Related Publication 20110031990A1 · Feb 10, 2011