Powering and controlling light emitting diodes via thermally separated arrays of dissipative active elements

1. A chipset for powering and controlling a plurality of light emitting diode (LED) strings, the chipset comprising:

a controller integrated circuit comprising a pulse width modulating (PWM) functionality and a data transfer interface circuitry; and

at least one dissipative active element array integrated circuit comprising a plurality of dissipative active elements, each of the dissipative active elements constituted of a respective field effect transistor, said at least one dissipative active element array integrated circuit packaged to be thermally separate from said controller integrated circuit, said at least one dissipative active element array integrated circuit arranged in a multi-chip module with said controller integrated circuit,

wherein the PWM functionality is arranged to individually pulse width modulate a current flow through each of the LED strings, and

wherein each of said plurality of dissipative active elements is associated with a particular one of the plurality of LED strings and is arranged to limit the current flow of the pulse width modulated current that flows through the particular LED string to a value, said value responsive to a value output by said controller integrated circuit via said data transfer interface circuitry.

2. A chipset according to claim 1 , comprising a plurality of said dissipative active element array integrated circuits, wherein said controller integrated circuit is arranged to control each of said plurality of dissipative active element array integrated circuits.

3. A chipset according to claim 1 , wherein said PWM functionality pulse width modulates said current flow by alternately enabling and disabling the respective one of said dissipative active elements.

4. A chipset according to claim 1 , wherein each dissipative active element comprises a field effect transistor (FET) having a drain, a source and a gate, and a comparator, said comparator arranged to compare a voltage representation of the current flowing through said FET with a reference, said reference responsive to said controller integrated circuit, the output of said comparator being coupled to the gate of said FET.

5. A chipset according to claim 1 , wherein each dissipative active element array integrated circuit further comprises:

a plurality of voltage samplers each operatively associated with a particular one of said dissipative active elements and arranged to sample a voltage associated with said particular dissipative active element indicative of the voltage drop over the associated LED string, each of said voltage samplers further arranged to output said sampled voltage to the data transfer interface circuitry of said controller integrated circuit.

6. A chipset according to claim 5 , wherein the controller integrated circuit further comprises:

a voltage sensing module; and

a power source control module in communication with said voltage sensing module,

wherein the voltage sensing module is arranged to receive said output sampled voltage of each of the plurality of voltage samplers via the data transfer interface circuitry, and identify responsive to the sampled voltages the LED string exhibiting the largest voltage drop, and

wherein the power source control module is arranged to control the voltage output of a power source arranged to power the plurality of LED strings responsive to said identified sampled voltage associated with the LED string exhibiting the largest voltage drop.

7. A chipset according to claim 6 , wherein said voltage sensing module is further arranged, responsive to a change in sampled voltage associated with a particular LED string, to determine one of a short circuit and an open circuit in one of the constituent LEDs of said particular LED string.

8. A chipset according to claim 6 , wherein said voltage sensing module is further arranged to identify an open circuit LED string.

9. A chipset according to claim 1 , wherein said at least one dissipative active element array integrated circuit further comprises over temperature protection for each of said dissipative active elements of said dissipative active element array integrated circuit, said over temperature protection arranged to disable current flow through said dissipative active element exhibiting an over temperature condition.

10. A chipset according to claim 9 , wherein said at least one dissipative active element array integrated circuit is further arranged to output an indication of said over temperature condition to said controller integrated circuit.

11. A chipset according to claim 1 , wherein said at least one dissipative active element array integrated circuit further comprises an over-voltage indication functionality arranged to detect an over voltage condition associated with any of the plurality of LED strings and immediately pass said indication to said controller integrated circuit.

12. A chipset according to claim 1 , wherein the PWM functionality is arranged to employ leading edge modulation.

13. A method of powering and controlling a plurality of LED strings using a single power source, the method comprising:

providing a controller integrated circuit and a plurality of dissipative active element array integrated circuits, each of said provided dissipative active element array integrated circuits comprising a plurality of dissipative active elements, each of the plurality of dissipative active elements arranged to limit current flow through a particular one of the plurality of LED strings;

thermally separating said provided plurality of dissipative active element array integrated circuits from said provided controller integrated circuit;

dissipatively limiting, responsive to said provided controller integrated circuit, the current flow through at least one of the LED strings by control of the respective dissipative active element;

sampling the voltage of each of the plurality of LED strings;

identifying the LED string exhibiting the largest voltage drop; and

adjusting the voltage output of the single power source responsive to said identified LED string exhibiting the largest voltage drop.

14. The method according to claim 13 , further comprising:

sampling the voltage of each of the plurality of LED strings; and

identifying an open circuit LED string responsive to the sampled voltages.

15. The method according to claim 13 , further comprising:

sampling temperature levels of each of said dissipative active elements;

detecting an over temperature condition of at least one dissipative active element; and

disabling current flow through said dissipative active element exhibiting an over temperature condition.

16. The method according to claim 13 , further comprising:

identifying, by one of said provided plurality of dissipative active element array integrated circuits, an over-voltage condition associated with any of the plurality of LED strings; and

promptly transmitting said identified condition to said provided controller integrated circuit.

17. A lighting system comprising:

a controller integrated circuit comprising a pulse width modulating (PWM) functionality and a data transfer interface circuitry;

a plurality of dissipative active element array integrated circuits each comprising a plurality of dissipative active elements, said plurality of dissipative active element array integrated circuits packaged to be thermally separate from said controller, said plurality of dissipative active element array integrated circuits arranged in a multi-chip module with said controller integrated circuit, said controller integrated circuit arranged to control each of said plurality of dissipative active element array integrated circuits;

a controllable power source responsive to said controller integrated circuit; and

a plurality of LED strings receiving power from said controllable power source,

wherein the PWM functionality is arranged to individually pulse width modulate a current flow through each of the LED strings,

wherein each of said plurality of dissipative active elements is associated with a particular one of the plurality of LED strings and is arranged to limit the current flow of the pulse width modulated current that flows through the particular LED string to a value, said value responsive to a value output by said controller integrated circuit via said data transfer interface circuitry.

18. A lighting system according to claim 17 , wherein each dissipative active element array integrated circuit further comprises:

a plurality of voltage samplers each operatively associated with a particular one of said dissipative active elements and arranged to sample a voltage associated with said particular dissipative active element indicative of the voltage drop over the associated LED string, each of said voltage samplers further arranged to output said sampled voltage to the data transfer interface circuitry of said controller integrated circuit.

19. A lighting system according to claim 17 , wherein each dissipative active element array integrated circuit further comprises:

an over-voltage indication functionality arranged to detect an over voltage condition associated with any of the plurality of LED strings and immediately pass said indication to said controller integrated circuit.