IP Library Granted Patent US 8,513,687
Granted Patent B2
US 8,513,687 · App. 12/548,939 · Granted Aug 20, 2013

Semiconductor light emitting device and semiconductor light emitting apparatus

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Quick Facts
Patent No.
US 8,513,687
App. No.
12/548,939
Granted
Aug 20, 2013
Kind
B2
Abstract

A semiconductor light emitting device, includes: a stacked structure unit including a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer; a first electrode provided on a first major surface of the stacked structure unit on the second semiconductor layer side to connect to the first semiconductor layer; and a second electrode provided on the first major surface of the stacked structure unit to connect to the second semiconductor layer. The second electrode includes: a first film provided on the second semiconductor layer; and a second film provided on a rim of the first film on the second semiconductor layer. The first film has a relatively low contact resistance with the second semiconductor layer. The second film has a relatively high contact resistance with the second semiconductor layer. A distance from an outer edge of the second film to the first film is smaller at a central portion than at a peripheral portion of the first major surface.

Claims (24)

1. A semiconductor light emitting device, comprising:

a stacked structure unit including a first semiconductor layer, a second semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer;

a first electrode provided on a first major surface of the stacked structure unit on the second semiconductor layer side to connect to the first semiconductor layer; and

a second electrode provided on the first major surface of the stacked structure unit to connect to the second semiconductor layer,

the second electrode including:

a first film provided on the second semiconductor layer, the first film being physically in contact with the second semiconductor layer, the first film having a first contact resistance with the second semiconductor layer; and

a second film provided along a rim of the first film, on the rim, and on the second semiconductor layer, a part of the second film being in contact with the second semiconductor layer, the second film having a second contact resistance with the second semiconductor layer, the second contact resistance being higher than the first contact resistance,

a maximum value of a first distance from an outer edge of the second film to the first film at a first region being smaller than a minimum value of a second distance from the outer edge of the second film to the first film at a second region, the first region being between the first film and the first electrode, the second region being a portion where the first film does not oppose the first electrode.

2. The device according to claim 1 , wherein

the first major surface includes:

a first portion, and

a second portion provided along an outer edge of the first major surface and surrounding the first portion, a distance from the outer edge of the first major surface to the second portion is shorter than a distance from the outer edge of the first major surface to the first portion,

a first width of a region where the second film contacts the second semiconductor layer in the first portion is narrower than a second width of a region where the second film contacts the second semiconductor layer in the second portion.

3. The device according to claim 1 , wherein the first film is ohmic with respect to the second semiconductor layer and the second film is non-ohmic with respect to the second semiconductor layer.

4. The device according to claim 1 , wherein the first film includes silver or silver alloy.

5. The device according to claim 1 , wherein the second film includes Al or Al alloy.

6. The device according to claim 1 , wherein a first width of a region where the second film contacts the second semiconductor layer in the first region is narrower a second width of a region where the second film contacts the second semiconductor layer in the second region.

7. The device according to claim 6 , wherein the second film is refractive.

8. The device according to claim 1 , wherein

the first major surface includes:

a first portion, and

a second portion provided along an outer edge of the first major surface and surrounding the first portion, a distance from the outer edge of the first major surface to the second portion is shorter than a distance from the outer edge of the first major surface to the first portion,

a distance from the outer edge of the second film to the first film at the first portion is smaller than a distance from the outer edge of the second film to the first film at a second portion.

9. The device according to claim 6 , wherein the second film is refractive.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →