IP Library Granted Patent US 8,030,614
Granted Patent B2
US 8,030,614 · App. 12/549,828 · Granted Oct 4, 2011

Charged particle beam apparatus and dimension measuring method

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Quick Facts
Patent No.
US 8,030,614
App. No.
12/549,828
Granted
Oct 4, 2011
Kind
B2
Abstract

There is provided a charged particle beam apparatus which allows implementation of a high-reliability and high-accuracy dimension measurement even if height differences exist on the surface of a sample. The charged particle beam apparatus includes the following configuration components: An acquisition unit for acquiring a plurality of SEM images whose focus widths are varied in correspondence with the focal depths, a determination unit for determining, from the plurality of SEM images acquired, a SEM image for which the image sharpness degree of the partial domain including a dimension-measuring domain becomes the maximum value, and a measurement unit for measuring the dimension of the predetermined domain from the SEM image whose image sharpness degree is the maximum value.

Claims (16)

1. A dimension measuring method for measuring dimension of patterns formed on a specimen in accordance with electrons obtained by scanning of electron beam for the specimen, comprising the steps of:

obtaining plurality of images by using electron beam of different focus condition;

evaluating focus condition selectively of at least two partial domains as to the obtained plurality of images; and

measuring dimension between edges of a pattern included in a partial domain using images of which focus of the partial domain is focalized.

2. A dimension measuring method according to claim 1 , wherein as to at least two partial domains, focus evaluation is carried out in accordance with a different focus evaluation method.

3. A dimension measuring method according to claim 1 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in a different direction.

4. A dimension measuring method according to claim 1 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in accordance with direction of edge included in the partial domain.

5. A dimension measuring method according to claim 1 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in accordance with differential filter of a different direction.

6. A dimension measuring method according to claim 1 , wherein as to the plurality of partial domains, measurement of dimension between edges is carried out using images of a different focus condition.

7. A pattern dimension measurement apparatus including a processing unit for measuring dimension of a pattern formed on a specimen in accordance with a detection signal detected by a scanning electron microscope, wherein:

the processing unit obtains a plurality of images using electron beam of different focus condition, selectively evaluates focus condition of at least two partial domains as to the obtained plural images, and measures dimension between edges of a pattern included in a partial domain using an image of which focus of the partial domain is focalized.

8. A dimension measuring method according to claim 7 , wherein as to at least two partial domains, focus evaluation is carried out in accordance with a different focus evaluation method.

9. A dimension measuring method according to claim 7 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in a different direction.

10. A dimension measuring method according to claim 7 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in accordance with direction of edge included in the partial domain.

11. A dimension measuring method according to claim 7 , wherein as to at least two partial domains, sharpness degree evaluation is carried out in accordance with differential filter of different direction.

12. A dimension measuring method according to claim 7 , wherein as to the plurality of partial domains, measurement of dimension between edge is carried out using images of a different focus condition.

Assignments (1)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →