Edge mounted integrated circuits with heat sink
View Patent ↗A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge and electronic circuits having ports on the second edge. The second edges are connected to the substrate. The first major surface of the second integrated circuit is parallel with the second major surface of the first integrated circuit. The heat sink has a backplane adjacent to the third edge, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit.
1. A module, comprising:
a module substrate;
a first integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the first integrated circuit has optical circuits having ports on the first edge and electronic circuits having ports on the second edge, wherein physical and electrical connections are made to the module substrate at the second edge;
a second integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the second integrated circuit has optical circuits having ports on the first edge of the second integrated circuit and electronic circuits having ports on the second edge of the second integrated circuit, wherein physical and electrical connections are made to the module substrate at the second edge of the second integrated circuit, the first major surface of the second integrated circuit is parallel with and adjacent to the second major surface of the first integrated circuit;
a heat sink having a backplane adjacent to the third edges of the respective first and second integrated circuits, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit.
2. The module of claim 1 , wherein the insert has a first major surface and a second major surface and the first major surface of the insert has an area more than half that of the second major surface of the first integrated circuit.
3. The module of claim 1 , wherein the insert has a first major surface and a second major surface and the first major surface of the insert has an area more than ninety percent that of the second major surface of the first integrated circuit.
4. The module of claim 1 , wherein the first and the second integrated circuits each have a fourth edge having optical ports.
5. The module of claim 1 , wherein the first and second integrated circuits each have a fourth edge and the heat sink further comprises a top plane adjacent to the fourth edges of the first and second integrated circuits.
6. The module of claim 1 , further comprising a third integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the third integrated circuit has optical circuits having ports on the first edge of the second integrated circuit and electronic circuits having ports on the second edge of the third integrated circuit, wherein physical and electrical connections are made to the module substrate at the second edge of the third integrated circuit, the first major surface of the third integrated circuit is parallel with and adjacent to the second major surface of the second integrated circuit.
7. The module of claim 6 , wherein the second portion of the heat sink is adjacent to the first surface of the third integrated circuit and functions as a second insert.
8. The module of claim 7 , wherein the second portion of the heat sink has a major surface with an area greater than half that of the first major surface of the third integrated circuit.
9. The module of claim 1 , wherein the insert physically contacts the first major surface of the second integrated circuit and the second major surface of the first integrated circuit.
10. The module of claim 1 , wherein the second edge of the first integrated circuit has a plurality of castellations that are used in physically and electrically connecting to the module substrate.
11. The module of claim 1 , wherein the heat sink comprises metal.
12. The module of claim 1 , further comprising thermal grease between the second major surface of the first integrated circuit and the insert.
13. The module of claim 1 , wherein the first edges of the first and the second integrated circuits are further characterized as each having a bevel to provide optical communication between the first and the second integrated circuits.
14. A module, comprising:
a module substrate;
a first integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the first integrated circuit has electronic circuits having ports on the second edge, wherein the second edge is physically and electrically connected to the module substrate;
a second integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the second integrated circuit has and electronic circuits having ports on the second edge of the second integrated circuit, the second edge of the second integrated circuit is physically and electrically connected to the module substrate, the first major surface of the second integrated circuit is parallel with and adjacent to the second major surface of the first integrated circuit;
a third integrated circuit having a first major surface, a second major surface, a first edge, a second edge, and a third edge, wherein the third integrated circuit has electronic circuits having ports on the second edge of the third integrated circuit, the second edge of the third integrated circuit is physically and electrically connected to the module substrate, the first major surface of the third integrated circuit is parallel with and adjacent to the second major surface of the second integrated circuit; and
a heat sink having a backplane adjacent to the third edges of the respective first, second, and third integrated circuits, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the third integrated circuit extending from the backplane, a first insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit, and a second insert between the first major surface of the third integrated circuit and the second major surface of the second integrated circuit.
15. The module of claim 14 , wherein:
the first integrated circuit has optical circuits having ports on the first edge of the first integrated circuit;
the second integrated circuit has optical circuits having ports on the first edge of the second integrated circuit; and
the third integrated circuit has optical circuits having ports on the first edge of the third integrated circuit.
16. The module of claim 15 , wherein the first edges of the first, the second and the third integrated circuits are further characterized as each having a bevel to provide optical communication among the first, second, and third integrated circuits.
17. The module of claim 14 , wherein the heat sink is spaced from the module substrate by stoppers on a bottom surface of the module substrate.
18. The module of claim 14 , wherein the first, the second and the third integrated circuits each have a fourth edge and the heat sink further comprises a top plane adjacent to the fourth edges of the first, the second and the third integrated circuits.