IP Library Granted Patent US 8,081,505
Granted Patent B2
US 8,081,505 · App. 12/556,389 · Granted Dec 20, 2011

Magnetoresistive element and method of manufacturing the same

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Quick Facts
Patent No.
US 8,081,505
App. No.
12/556,389
Granted
Dec 20, 2011
Kind
B2
Abstract

A magnetoresistive element includes a stacked structure including a fixed layer having a fixed direction of magnetization, a recording layer having a variable direction of magnetization, and a nonmagnetic layer sandwiched between the fixed layer and the recording layer, a first protective film covering a circumferential surface of the stacked structure, and made of silicon nitride, and a second protective film covering a circumferential surface of the first protective film, and made of silicon nitride. A hydrogen content in the first protective film is not more than 4 at %, and a hydrogen content in the second protective film is not less than 6 at %.

Claims (11)

1. A magnetoresistive element comprising:

a stacked structure comprising a fixed layer comprising a fixed direction of magnetization, a recording layer comprising a varied direction of magnetization, and a nonmagnetic layer between the fixed layer and the recording layer;

a first protective film over a circumferential surface of the stacked structure, comprising silicon nitride; and

a second protective film over a circumferential surface of the first protective film, comprising silicon nitride,

wherein a hydrogen content in the first protective film is not more than 4 at %, and

a hydrogen content in the second protective film is not less than 6 at %.

2. The element of claim 1 , wherein

the first protective film is formed by Physical Vapor Deposition (PVD), and the second protective film is formed by Chemical Vapor Deposition (CVD).

3. The element of claim 1 , wherein the hydrogen content in the second protective film is not more than 20 at %.

4. The element of claim 1 , further comprising an interlayer dielectric film around the second protective film.

5. The element of claim 4 , wherein the interlayer dielectric film comprises silicon oxide.

Assignments (4)
DE-MERGER Recorded Dec 12, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051260/0291 →
MERGER Recorded Dec 12, 2019
From: TOSHIBA MEMORY CORPORATION; K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051262/0776 →
CHANGE OF NAME AND ADDRESS Recorded Dec 12, 2019
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051262/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2009
From: KAJIYAMA, TAKESHI; ASAO, YOSHIAKI; TAKAHASHI, SHIGEKI; AMANO, MINORU; SUGIURA, KUNIAKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 023210/0524 →