Non-volatile semiconductor storage device and method of manufacturing the same

1. A non-volatile semiconductor storage device comprising:

a plurality of memory element groups, each of the memory element groups having a plurality of memory elements, each of the memory elements having a resistance-change element and a Schottky diode connected in series,

each of the memory element groups comprising:

a first columnar layer extending in a lamination direction;

a first insulation layer formed on a side surface of the first columnar layer and functioning as the resistance-change element; and

a first conductive layer formed to surround the first columnar layer via the first insulation layer,

the first conductive layer being formed of metal, and

the first columnar layer being formed of a semiconductor having such a impurity concentration that the first conductive layer and the semiconductor configure the Schottky diode.

2. The non-volatile semiconductor storage device according to claim 1 , wherein

the first conductive layer is formed of any one of TiB, TaB, HfSix, TiN, and Ta,

the first columnar layer is formed of p-type polysilicon, and

the first conductive layer and the first columnar layer configure the Schottky diode having an anode as the first columnar layer and a cathode as the first conductive layer.

3. The non-volatile semiconductor storage device according to claim 1 , wherein

the first conductive layer is formed of any one of Pt, WC, WB, TaC, W, Pt, TiN, CoSi, and Co,

the first columnar layer is formed of n-type polysilicon, and

the first conductive layer and the first columnar layer configure the Schottky diode having a cathode as the first columnar layer and an anode as the first conductive layer.

4. The non-volatile semiconductor storage device according to claim 1 , further comprising a control circuit configured to control the memory element groups, wherein

the control circuit is formed below the memory element groups.

5. The non-volatile semiconductor storage device according to claim 4 , wherein

the control circuit comprises a transistor, the transistor comprising:

a source region formed on a surface of a substrate and functioning as a source of the transistor;

a drain region formed on the surface of the substrate at a certain distance from the source region and functioning as a drain of the transistor; and

a gate conductive layer formed across the source region and the drain region and functioning as a control gate of the transistor.

6. The non-volatile semiconductor storage device according to claim 1 , further comprising a selection transistor connected to one end of each of the memory element groups and configured to control conduction to the memory element groups,

wherein the selection transistor comprises:

a second columnar layer extending in a lamination direction from a top or bottom surface of the first columnar layer and functioning as a body of the selection transistor;

a second insulation layer formed on a side surface of the second columnar layer; and

a second conductive layer formed to surround the second columnar layer via the second insulation layer and functioning as a control gate of the selection transistor.

7. The non-volatile semiconductor storage device according to claim 6 , wherein

the second columnar layer is formed of a p-type semiconductor, and

the second conductive layer is formed of an n-type semiconductor.

8. A non-volatile semiconductor storage device comprising;

a plurality of memory element groups, each of the memory element groups having a plurality of memory elements, each of the memory elements having a resistance-change element and a Schottky diode connected in series,

each of the memory element groups comprising:

a first columnar layer extending in a lamination direction;

a first insulation layer formed on a side surface of the first columnar layer and functioning as the resistance-change element; and

a first conductive layer formed to surround the first columnar layer via the first insulation layer,

the first columnar layer being formed of metal, and

the first conductive layer being formed of a semiconductor having such a impurity concentration that the first columnar layer and the semiconductor configure the Schottky diode.

9. The non-volatile semiconductor storage device according to claim 8 , wherein

the first columnar layer is formed of any one of TiB, TaB, HfSix, TiN, and Ta,

the first conductive layer is formed of p-type polysilicon, and

the first columnar layer and the first conductive layer configure the Schottky diode having an anode as the first columnar layer and a cathode as the first conductive layer.

10. The non-volatile semiconductor storage device according to claim 8 , wherein

the first columnar layer is formed of any one of Pt, WC, WB, TaC, W, Pt, TiN, CoSi, and Co,

the first conductive layer is formed of n-type polysilicon, and

the first columnar layer and the first conductive layer configure the Schottky diode having a cathode as the first columnar layer and an anode as the first conductive layer.

11. The non-volatile semiconductor storage device according to claim 8 , further comprising a control circuit configured to control the memory element groups, wherein

the control circuit is formed below the memory element groups.

12. The non-volatile semiconductor storage device according to claim 11 , wherein

the control circuit comprises a transistor, the transistor comprising:

a source region formed on a surface of a substrate and functioning as a source of the transistor;

a drain region formed on the surface of the substrate at a certain distance from the source region and functioning as a drain of the transistor; and

a gate conductive layer formed across the source region and the drain region and functioning as a control gate of the transistor.

13. The non-volatile semiconductor storage device according to claim 8 , further comprising a selection transistor connected to one end of each of the memory element groups and configured to control conduction to the memory element groups,

wherein the selection transistor comprises:

a second columnar layer extending in a lamination direction from a top or bottom surface of the first columnar layer and functioning as a body of the selection transistor;

a second insulation layer formed on a side surface of the second columnar layer; and

a second conductive layer formed to surround the second columnar layer via the second insulation layer and functioning as a control gate of the selection transistor.

14. The non-volatile semiconductor storage device according to claim 13 , wherein

the second columnar layer is formed of a p-type semiconductor, and

the second conductive layer is formed of an n-type semiconductor.

15. A method of manufacturing a non-volatile semiconductor storage device having a plurality of memory element groups, each of the memory element groups having a plurality of memory elements, each of the memory elements having a resistance-change element and a Schottky diode connected in series, the method comprising:

laminating a plurality of first conductive layers;

forming a first hole to penetrate the plurality of first conductive layers;

forming a first insulation layer on a side surface of the first hole, the first insulation layer functioning as the resistance-change element; and

forming a first columnar layer to fill up the first hole,

the first conductive layers being formed of metal; and

the first columnar layer being formed of a semiconductor having such a impurity concentration that the first conductive layers and the semiconductor configure the Schottky diode.

16. The method of manufacturing the non-volatile semiconductor storage device according to claim 15 , wherein

the first conductive layers are formed of any one of TiB, TaB, HfSix, TiN, and Ta, and

the first columnar layer is formed of p-type polysilicon.

17. The method of manufacturing the non-volatile semiconductor storage device according to claim 15 , wherein

the first conductive layers are formed of any one of Pt, WC, WB, TaC, W, Pt, TiN, CoSi, and Co, and

the first columnar layer is formed of n-type polysilicon.

18. The method of manufacturing the non-volatile semiconductor storage device according to claim 15 , further comprising:

depositing a second conductive layer prior to the lamination of the first conductive layers, the second conductive layer functioning as a control gate of a selection transistor, the selection transistor controlling conduction to the memory element groups;

forming a second hole to penetrate the second conductive layer;

forming a second insulation layer on a side surface of the second hole; and

forming a second columnar layer to fill up the second hole, the second columnar layer functioning as a body of the selection transistor.

19. The method of manufacturing the non-volatile semiconductor storage device according to claim 18 , wherein

the second columnar layer is formed of a p-type semiconductor, and

the second conductive layer is formed of an n-type semiconductor.

20. The method of manufacturing the non-volatile semiconductor storage device according to claim 18 , further comprising:

depositing a third conductive layer prior to the deposition of the second conductive layer, the third conductive layer functioning as a wiring connected to one end of the selection transistor; and

forming a trench to penetrate the third conductive layer and extend in a first direction orthogonal to a lamination direction at a certain pitch in a second direction, the second direction being orthogonal to the lamination and first directions.