Photosensitive dielectric paste and electronic part made with the same
Provided is a photosensitive dielectric paste capable of being burned at a low temperature in a short time and forming a dielectric film (insulator film) having favorable properties, such as sintering properties or temperature characteristics of dielectric constant, and an electronic part having favorable properties having a dielectric film formed using the same. The photosensitive dielectric paste of the invention contains (a) an inorganic ingredient containing 10 to 30% by volume of dielectric powder containing a Ba—Nd—Ti complex oxide powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi in a proportion of 50 to 90% by weight in terms of Bi 2 O 3 ; and (b) a photosensitive organic ingredient, in which the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide. As the supporting glass powder, a glass powder containing Si in a proportion of 70 to 90% by weight in terms of SiO 2 is used.
1. A photosensitive dielectric paste comprising an inorganic ingredient and a photosensitive organic ingredient, wherein
(a) the inorganic ingredient comprises 10 to 30% by volume of a Ba—Nd—Ti complex oxide dielectric powder, 50 to 80% by volume of supporting glass powder, and 1 to 20% by volume of sintering aid glass powder containing Bi; and
(b) the Ba—Nd—Ti complex oxide powder reacts with the sintering aid glass powder upon burning to thereby produce a Bi—Nd—Ti complex oxide.
2. A photosensitive dielectric paste according to claim 1 , wherein the inorganic ingredient contains at least one inorganic powder selected from the group consisting of quartz, alumina, mullite, and zirconia in a total proportion of 10 to 30% by volume; and
the inorganic powder is 50% by volume or less based on the total volume of the dielectric powder and the inorganic powder.
3. The photosensitive dielectric paste according to claim 2 , wherein the sintering aid glass powder contains 50 to 90% of Bi in terms of Bi 2 O 3 .
4. The photosensitive dielectric paste according to claim 3 , wherein the supporting glass powder contains Si in a proportion of 70 to 90% by weight in terms of SiO 2 .
5. The photosensitive dielectric paste according to claim 3 , wherein the supporting glass powder has a softening point which is lower by about 100 to 400° C. than the maximum burning temperature, and the sintering aid glass powder has a softening point which is lower than that of the supporting glass powder.
6. The photosensitive dielectric paste according to claim 5 , wherein the supporting glass powder is a low alkali borosilicate glass that can be burned at about 800° C. to 900° C.
7. The photosensitive dielectric paste according to claim 1 , wherein the sintering aid glass powder contains 50 to 90% of Bi in terms of Bi 2 O 3 .
8. The photosensitive dielectric paste according to claim 7 , wherein the supporting glass powder contains Si in a proportion of 70 to 90% by weight in terms of SiO 2 .
9. The photosensitive dielectric paste according to claim 1 , wherein the supporting glass powder contains Si in a proportion of 70 to 90% by weight in terms of SiO 2 .
10. The photosensitive dielectric paste according to claim 1 , wherein the supporting glass powder has a softening point which is lower by about 100 to 400° C. than the maximum burning temperature, and the sintering aid glass powder has a softening point which is lower than that of the supporting glass powder.
11. The photosensitive dielectric paste according to claim 1 , wherein the supporting glass powder is a low alkali borosilicate glass that can be burned at about 800° C. to 900° C.
12. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 1 .
13. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 2 .
14. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 3 .
15. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 4 .
16. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 5 .
17. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 6 .
18. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 7 .
19. An electronic part comprising a dielectric film which is a sintered photosensitive dielectric paste according to claim 9 .