Reliable interconnect for semiconductor device
View Patent ↗A method for forming a semiconductor device is presented. A substrate prepared with a dielectric layer formed thereon is provided. A sacrificial and a hard mask layer are formed on the dielectric layer. The dielectric, sacrificial and hard mask layers are patterned to form an interconnect opening. The interconnect opening is filled with a conductive material to form an interconnect. The conductive material is processed to produce a top surface of the conductive material that is substantially planar with a top surface of the sacrificial layer. The sacrificial layer is removed. The sacrificial layer protects the dielectric layer during processing of the conductive material.
1. A method for forming a semiconductor device comprising:
providing a substrate prepared with a dielectric layer formed thereon, wherein the dielectric layer has a hydrophobic characteristic, and the dielectric layer has not been subjected to a chemical mechanical polishing process;
non-selectively forming a sacrificial layer on the dielectric layer, wherein the sacrificial layer can be removed by a non-etch or non-polishing process;
forming a hard mask layer on the sacrificial layer;
patterning the dielectric, sacrificial and hard mask layers to form an interconnect opening;
filling the interconnect opening with a conductive material to form an interconnect;
processing the conductive material to produce a top planar surface of the conductive material in the interconnect opening, wherein the hard mask layer is removed to expose a top surface of the sacrificial layer; and
removing the sacrificial layer using a non-etch or non-polishing process while maintaining the hydrophobic characteristic of the dielectric layer.
2. The method of claim 1 wherein removing the sacrificial layer comprises annealing the semiconductor device to decompose the sacrificial layer.
3. The method of claim 1 wherein the dielectric layer comprises a low-k or ultra low-k dielectric material.
4. The method of claim 1 wherein the sacrificial layer comprises a thermally decomposable material.
5. The method of claim 4 wherein the thermally decomposable material comprises carbon-containing material or polynorbornene or a combination thereof.
6. The method of claim 4 wherein removing the sacrificial layer comprises annealing the thermally decomposable material in a reducing ambient.
7. The method of claim 1 wherein processing comprises chemical mechanical polishing the conductive material.
8. The method of claim 1 wherein the hard mask layer is removed:
after processing the conductive material; or
prior to filling the interconnect opening with the conductive material.
9. The method of claim 1 wherein forming the sacrificial layer comprises a spin coating process.
10. The method of claim 1 comprises forming a capping layer on the top surface of the conductive material, the capping layer protecting the conductive material during subsequent processing.
11. The method of claim 10 wherein removing the sacrificial layer is performed after forming the capping layer on the top surface of the conductive material.
12. The method of claim 11 further comprising forming an upper dielectric layer over the dielectric layer and the capping layer after removing the sacrificial layer.
13. A method for forming a semiconductor device comprising:
providing a substrate prepared with a dielectric layer formed thereon, wherein the dielectric layer has a hydrophobic characteristic, and the dielectric layer has not been subjected to a chemical mechanical polishing process;
non-selectively forming a sacrificial layer on the dielectric layer, wherein the sacrificial layer can be removed by a non-etch or non-polishing process;
forming a hard mask layer on the sacrificial layer;
forming an interconnect opening in the dielectric, sacrificial and hard mask layers;
filling the interconnect opening with a conductive material to form an interconnect;
polishing the conductive material to produce a top planar surface of the conductive material in the interconnect opening, wherein the hard mask layer is removed to expose a top surface of the sacrificial layer; and
removing the sacrificial layer using a non-etch or non-polishing process while maintaining the hydrophobic characteristic of the dielectric layer.
14. The method of claim 13 wherein polishing the conductive material comprises chemical mechanical polishing process.
15. The method of claim 13 wherein the sacrificial layer comprises a thermally decomposable material.
16. The method of claim 15 wherein the thermally decomposable material comprises carbon-containing material or polynorbornene or a combination thereof.
17. The method of claim 13 wherein removing the sacrificial layer comprises annealing the semiconductor device to decompose the sacrificial layer.
18. The method of claim 17 comprises annealing the semiconductor device at a temperature range of about 100-500° C.
19. The method of claim 13 wherein the hard mask layer is removed:
after polishing the conductive material; or
prior to filling the interconnect opening with the conductive material.
20. The method of claim 13 comprises selectively forming a capping layer on the top surface of the conductive material, the capping layer protecting the conductive material during subsequent processing.
21. The method of claim 20 wherein removing the sacrificial layer is performed after forming the capping layer on the top surface of the conductive material.