Light emitting diode having algan buffer layer and method of fabricating the same
View Patent ↗The present invention relates to a light emitting diode having an Al x Ga 1−x N buffer layer and a method of fabricating the same, and more particularly, to a light emitting diode having an Al x Ga 1−x N buffer layer, wherein between a substrate and a GaN-based semiconductor layer, the Al x Ga 1−x N (0≦x≦1) buffer layer having the composition ratio x of Al decreasing from the substrate to the GaN-based semiconductor layer is interposed to reduce lattice mismatch between the substrate and the GaN-based semiconductor layer, and a method of fabricating the same. To this end, the present invention provides a light emitting diode comprising a substrate; a first conductive semiconductor layer positioned on the substrate; and an Al x Ga 1−x N (0≦x≦1) buffer layer interposed between the substrate and the first conductive semiconductor layer and having a composition ratio x of Al decreasing from the substrate to the first conductive semiconductor layer.
1. A light emitting diode, comprising:
a substrate;
a first conductive semiconductor layer positioned on the substrate; and
an Al x Ga 1−x N (0≦x≦1) buffer layer interposed between the substrate and the first conductive semiconductor layer and comprising
a first region having a composition ratio x of Al decreasing from the substrate to the first conductive semiconductor layer,
wherein the composition ratio of Al decreases in a declined stepwise manner,
wherein the first region of the Al x Ga 1−x N buffer layer comprises alternating
declining portions having a decreasing composition ratio of Al and
constant portions having a constant composition ratio of Al,
wherein a composition ratio of Al of a first constant portion and a composition ratio of Al of a second constant portion have a difference of 0.2,
wherein the second constant portion is the step after the first constant portion in the declined stepwise decrease, and
wherein the declining portions and constant portions are of comparable thicknesses.
2. The light emitting diode as claimed in claim 1 , further comprising a second region of the Al x Ga 1−x N buffer layer having the composition ratio of Al equal to 1.
3. The light emitting diode as claimed in claim 2 , wherein the second region has a thickness of about 1 nm to about 50 nm.
4. The light emitting diode as claimed in claim 2 , wherein the second region is disposed between the substrate and the first region.
5. The light emitting diode as claimed in claim 1 , further comprising a third region of the Al x Ga 1−x N buffer layer having the composition ratio of Al equal to 0.
6. The light emitting diode as claimed in claim 5 , wherein the third region has a thickness of about 1 nm to about 50 nm.
7. The light emitting diode as claimed in claim 5 , wherein the third region is disposed between the first conductive semiconductor layer and the first region.
8. The light emitting diode as claimed in claim 1 , wherein the constant portions each have a thickness of about 1 nm to about 30 nm.
9. The light emitting diode as claimed in claim 1 , wherein the constant portions each have a thickness of 20 nm to 30 nm.
10. A method of fabricating a light emitting diode, comprising the steps of:
preparing a substrate;
forming an AlxGa1−xN (0≦x≦1) buffer layer on the substrate,
the buffer layer having a composition ratio of Al decreasing toward a surface thereof; and
forming a GaN-based semiconductor layer on the AlxGa1−xN buffer layer,
wherein the composition ratio of Al decreases in a declined stepwise manner,
wherein the first region of the Al x Ga 1−x N buffer layer comprises alternating
declining portions having a decreasing composition ratio of Al and
constant portions having a constant composition ratio of Al,
wherein a composition ratio of Al of a first constant portion and a composition ratio of Al of a second constant portion have a difference of 0.2,
wherein the second constant portion is the step after the first constant portion in the declined stepwise decrease, and
wherein the declining portions and constant portions are of comparable thicknesses.