IP Library › Patent Application 12578556
Patent Application
App. No. 12/578,556

LEAD FRAME AND METHOD OF FORMING SAME

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
12/578,556
Abstract

A lead frame and a method of making a lead frame for a semiconductor package. The lead frame is formed by stamping a lead frame material into a desire configuration. The stamped lead frame is then affixed to a support material. When assembling a semiconductor package using the lead frame, during saw singuation, the saw does not have to cut through much lead frame material. Thus, the saw blade does not wear quickly.

Claims (22)

1 . A method of fabricating a lead frame, the method comprising:

stamping a lead frame material into a desired lead frame configuration, the lead frame configuration including a plurality of leads and a die flag; and

supporting the stamped lead frame configuration with a support material.

2 . The method of claim 1 , further comprising adhering the stampled lead frame configuration to the support material.

3 . The method of claim 1 , wherein the support material is adhesive tape.

4 . The method of claim 3 wherein the adhesive tape is silicon tape or acrylic tape.

5 . A method of assembling a plurality of semiconductor packages, comprising:

forming a plurality of lead frames by stamping a lead frame material into a plurality of desired lead frame configurations, each lead frame configuration including a plurality of leads and a die flag;

supporting the stamped lead frames configurations with a support material;

bonding a corresponding plurality of semiconductor dies to the plurality of lead frame die flags;

wire bonding with wires the semiconductor dies to the leads of respective lead frame configurations;

molding the lead frame configurations, semiconductor dies, and wires to form the plurality of semiconductor packages;

removing the support material; and

separating the plurality of semiconductor packages via saw singulation.

6 . The method of claim 5 , further comprising adhering lead frame configurations to the support material.

7 . The method of claim 5 , wherein the support material is adhesive tape.

8 . The method of claim 7 , wherein the adhesive tape is silicon tape or acrylic tape.

9 . A lead frame for a semiconductor package, comprising:

a lead frame configuration formed by stamping a lead frame material; and

a supporting material to support the lead frame configuration.

10 . The lead frame of claim 9 , wherein the support material is adhesive tape.

11 . The lead frame of claim 10 , wherein the adhesive tape is silicon tape or acrylic tape.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037355/0723 →
SECURITY AGREEMENT Recorded Mar 15, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 024079/0082 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2009
From: GAO, XU; HE, QINGCHUN; XU, NAN
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 023393/0178 →