IP Library › Patent Application 12588361
Patent Application
App. No. 12/588,361

Rolled copper foil

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Patent No.
US None
App. No.
12/588,361
Abstract

A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.

Claims (22)

1 . A rolled copper foil, comprising:

copper (Cu);

an inevitable impurity,

a first additive element that forms a solid solution in the copper; and

a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.

2 . The rolled copper foil according to claim 1 , further comprising not more than 0.002 wt. % of oxygen.

3 . The rolled copper foil according to claim 1 , wherein

the first additive element comprises not less than 0.005 wt. % and not more than 0.05 wt. % of silver (Ag).

4 . The rolled copper foil according to claim 2 , wherein

the first additive element comprises not less than 0.005 wt. % and not more than 0.05 wt. % of silver (Ag).

5 . The rolled copper foil according to claim 1 , wherein

the second additive element comprises not less than 0.001 wt. % and not more than 0.09 wt. % of boron (B).

6 . The rolled copper foil according to claim 4 , wherein

the second additive element comprises not less than 0.001 wt. % and not more than 0.09 wt. % of boron (B).

7 . The rolled copper foil according to claim 3 , wherein

the second additive element comprises one element selected from the group consisting of niobium (Nb), titanium (Ti), nickel (Ni), zirconium (Zr), vanadium (V), manganese (Mn), hafnium (HO, tantalum (Ta), and calcium (Ca), and a content thereof is not less than 0.001 wt. % and not more than 0.09 wt. %.

8 . The rolled copper foil according to claim 3 , wherein

the second additive element comprises a plurality of elements selected from boron (B), niobium (Nb), titanium (Ti), nickel (Ni), zirconium (Zr), vanadium (V), manganese (Mn), hafnium (Hf), tantalum (Ta), and calcium (Ca), and a total content thereof is not less than 0.001 wt. % and not more than 0.09 wt. %.

9 . The rolled copper foil according to claim 1 , wherein

the rolled copper foil is formed to be in a crystal grain orientation state in which, as a result obtained by pole figure measurement using X-ray diffraction taking rolled surface as a reference point, the ratio [a]/[b] of β-scanning average diffraction peak intensities [a] at α=90° and [b] at α=30° of the pole figure measurement of a {022} Cu copper crystal plane is [a]/[b]≧3.

10 . The rolled copper foil according to claim 1 , wherein

the rolled copper foil comprises a thickness of not more than 20 μm.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2013
From: HITACHI CABLE, LTD.
To: SH COPPER PRODUCTS CO., LTD.
Reel/Frame 030716/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2009
From: MUROGA, TAKEMI; SEKI, SATOSHI; HAGIWARA, NOBORU
To: HITACHI CABLE, LTD.
Reel/Frame 023402/0359 →