Electronic device and lid
View Patent ↗The present invention can prevent a lid from tilting when the lid is attached to a substrate. An electronic device 200 includes: a substrate 202 ; an electronic component mounted on the substrate 202 ; and a lid 100 including a cover portion 102 protruding in a direction opposite the substrate 202 and covering the electronic component and a flange portion 104 arranged at the periphery of the cover portion 102 and adhered to the substrate 202 . A protrusion portion 106 protruding for a predetermined height in a direction of the substrate 202 compared to other areas of the flange portion 104 is arranged on the flange portion 104 of the lid 100.
1. An electronic device, comprising:
a substrate;
an electronic component mounted on one side of the substrate; and
a lid including a cover portion protruding in a direction opposite the one side of the substrate and covering the electronic component, and a flange portion arranged at a periphery of, the cover portion and at least partially adhered to the substrate,
wherein one side the flange portion of the lid includes a first area and a second area other than the first area, and a distance between a side of the first area facing the one side of the substrate and the one side of the substrate is smaller than the distance between a side of the second area facing the one side of the substrate and the one side of the substrate.
2. The electronic device according to claim 1 , wherein the first area is arranged at a corner of the flange portion.
3. The electronic device according to claim 2 , wherein a plurality of ones of the first area is arranged at four corners of the flange portion.
4. The electronic device according to claim 1 , wherein the first area is electrically connected to a ground terminal formed on the one side of the substrate.
5. The electronic device according to claim 1 , wherein an adhesive is arranged between the second area and the one side of the substrate.
6. A lid arranged cm a substrate mounted with an electronic component and covering the electronic component, the lid comprising:
a cover portion protruding in a first direction so as to cover the electronic component when arranged on the substrate; and
a flange portion including a protrusion portion arranged at a periphery of the cover portion,
wherein one side of the flange portion includes a first area and a second area other than the first arca, and a distance between a side of the first area facing the one side of the substrate and the one side of the substrate is smaller than a distance between a side of the second area facing the one side of the substrate and the one side of the substrate.
7. The lid according to claim 6 , wherein a plurality of ones of the first area is arranged on the flange portion of the lid.
8. The lid according to claim 7 , wherein the plurality of ones of the first area is arranged so that a center of gravity at a vertex of the plurality of ones of the first area corresponds to a center of gravity of the lid.
9. The lid according to claim 7 , wherein the lid has a rectangular shape in a plan view, and the plurality of ones of the first area is arranged at corners of the flange portion.
10. The lid according to claim 9 , further comprising:
at least four first areas,
wherein the first areas are arranged at four corners of the flange portion.
11. The electronic device according to claim 1 , wherein said one side of the flange portion of the lid includes a plurality of ones of the first area.
12. The electronic device according to claim 1 , wherein a plurality of ones of the first area is arranged on the flange portion of the lid.
13. The electronic device according to claim 12 , wherein the plurality of ones of the first area is arranged on the flange portion such that a center of gravity at a vertex of the first areas corresponds to a center of gravity of the lid.
14. The electronic device according to claim 1 , wherein a plurality of the electronic components is mounted on the substrate.
15. The electronic device according to claim 14 , wherein a height of at least one electronic component of the plurality of the electronic components is higher than a height of other electronic components.
16. The electronic device according to claim 1 , further comprising a heat dissipation paste arranged between the electronic component and the lid, the paste being in contact with the electronic component and the lid.
17. The electronic device according to claim 1 , wherein, in said one side of the flange portion of the lid, the second area is placed between a plurality of ones of the first area.
18. The electronic device according to claim 1 , wherein, with respect to the side of the substrate, a bottom surface of the second area is placed higher than a bottom surface of the first area.
19. The electronic device according to claim 6 , wherein, in said one side of the flange portion of the lid, the second area is placed between a plurality of ones of the first area.
20. The electronic device according to claim 6 , wherein, with respect to the side of the substrate, a bottom surface of the second area is placed higher than a bottom surface of the first area.