Seminconductor device

1. A signal transmitting/receiving method comprising:

disposing a ferromagnetic film between a semiconductor device having an inductor and an external device which includes an external inductor provided in a position corresponding to the inductor of the semiconductor device;

disposing the inductor and the external inductor so as to face each other via the ferromagnetic film therebetween; and

in a state in which the inductor and the external inductor face each other, transmitting and receiving the signals between the inductor and the external inductor by electromagnetic induction.

2. The signal transmitting/receiving method according to claim 1 , wherein in disposing the inductor and the external inductor so as to face each other, each of the inductor and the external inductor is disposed so as to be in contact with the ferromagnetic film.

3. The signal transmitting/receiving method according to claim 1 , wherein the semiconductor device further includes a substrate and an internal circuit provided in the substrate; and the inductor is provided to be electrically connected to the internal circuit, and

the signal transmitted and received between the external inductor and the inductor is a test signal for testing the internal circuit.

4. A semiconductor device manufacturing method comprising:

disposing a semiconductor device which includes a first insulating film which includes a transistor on a substrate and a second insulating film which is provided on the first insulating film and includes an inductor and an external device which includes an external inductor provided in a position corresponding to the inductor of the semiconductor device so as to face each other;

disposing a ferromagnetic film which includes ferromagnetic fine particles at least between the inductor of the semiconductor device and the external inductor of the external device;

disposing the inductor and the external inductor so as to face each other via the ferromagnetic film therebetween; and

transmitting and receiving signals between the inductor and the external inductor by electromagnetic induction in a state in which the inductor and the external inductor are made to face each other.

5. The semiconductor device manufacturing method according to claim 4 , wherein before the inductor and the external inductor are disposed so as to face each other, the ferromagnetic film is formed on at least the inductor of the semiconductor device.

6. The semiconductor device manufacturing method according to claim 4 , wherein the semiconductor device further includes a bonding pad provided on the second insulating film, and

after the signal is transmitted and received, the bonding pad and an external terminal are connected with a bonding wire.

7. The semiconductor device manufacturing method according to claim 6 , wherein in disposing the ferromagnetic film, the ferromagnetic film is also formed on the bonding pad, and

after the signal is transmitted and received, the ferromagnetic film formed on at least the bonding pad of the semiconductor device is removed.