Polyarylene sulfide resin composition and a molded article formed therefrom

1. A resin composition consisting essentially of the following components (A) to (D):

(A) a polyphenylene sulfide resin: 20 wt %<component (A)≦60 wt %;

(B) a powdered hexagonal boron nitride having a particle size of 30 μm to 200 μm: 8 wt % ≦component (B) ≦55 wt %;

(C) a flat glass fiber having a cross sectional oblateness of 2 to 20: 15 wt % ≦component (C) ≦55 wt %; and

(D) one or more resin additives selected from the group consisting of a mold release agent, a fire retardant, an anti-oxidant, an infrared radiation ratio improver, and a compatibilizer, where polyamide and polyphenylene ether are excluded,

wherein the amount of components (A) to (C) is a weight percentage relative to the total amount of the components (A) to (C).

2. The resin composition according to claim 1 , which has a dielectric breakdown strength of 25 kV/mm or more.

3. The resin composition according to claim 1 , which has an arc resistance of 180 seconds or more.

4. The resin composition according to claim 1 , which has a heat conductivity of 2 to 15 W/mK.

5. A molded article which is obtained by injection-molding the resin composition according to claim 1 .

6. A voltage-proof component comprising the molded article according to claim 5 .

7. The resin composition according to claim 1 , wherein:

(A): 23 wt % <component (A) ≦57 wt %;

(B): 8 wt % ≦component (B) ≦50 wt %; and

(C): 20 wt % ≦component (C) ≦45 wt %.

8. The resin composition according to claim 1 , wherein:

the composition has a dielectric breakdown strength of 25 kV/mm or more;

the composition has an arc resistance of 180 seconds or more; and

the composition has a heat conductivity of 2 to 15 W/mK.

9. The resin composition according to claim 1 , wherein the powdered hexagonal boron nitride has a particle size of 30 μm to 60 μm.