Dipping method of forming cathode of solid electrolytic capacitor
View Patent ↗The present invention relates to a method to produce a solid electrolytic capacitor by forming a dielectric layer on an anode body comprising a valve-acting metal sintered body having fine pores and forming on the dielectric layer a conductive compound layer to form a cathode, wherein a cathode is formed by repeating the step of dipping the anode body into an inorganic compound solution, an organic compound solution or a conductive-polymer compound dispersion liquid which turns into a conductive compound layer to thereby laminate a conductive layer on the anode body, and the depth of the anode body to be dipped is increased with each dipping; and an apparatus to be used for the method. According to the present invention, a satisfactory cathode layer can be efficiently formed and a solid electrolytic capacitor having a large capacitance and a low equivalent series resistance can be produced.
1. A method for producing a solid electrolytic capacitor which comprises forming a dielectric layer on an anode body comprising a valve-acting metal sintered body having fine pores and forming a cathode comprising a conductive compound layer on the dielectric layer,
wherein said step of forming the cathode comprises repeating a step of laminating the conductive compound layer on the dielectric formed on the anode body, which laminating step comprises dipping a part of the anode body to a predetermined depth into one of an inorganic compound solution, an organic compound solution or a conductive-polymer compound dispersion liquid, removing the anode body from the solution or dispersion to leave a liquid film on the anode body and drying the liquid film to form the conductive compound layer on the anode body to the predetermined depth, and
increasing a depth that the anode body is dipped in the solution or dispersion liquid with each dipping,
to thereby produce the solid electrolytic capacitor.
2. The method for producing the solid electrolytic capacitor as claimed in claim 1 , wherein the average diameter of fine pores of the valve-acting metal sintered body is 0.5 μm or less.
3. The method for producing the solid electrolytic capacitor as claimed in claim 1 , wherein each dipping in the solution or dispersion liquid is carried out for a time sufficient for the solution or dispersion liquid to penetrate inside the valve-acting metal sintered body by capillary action.
4. The method for producing the solid electrolytic capacitor as claimed in claim 3 , wherein the time of each dipping in the solution or dispersion liquid is from one to ten minutes.
5. The method for producing the solid electrolytic capacitor as claimed in claim 1 , which comprises forming the cathode by repeating the step of dipping the anode body in the solution or dispersion liquid under reduced pressure and subsequent heat decomposition or drying.
6. The method for producing the solid electrolytic capacitor as claimed in claim 1 , which comprises forming the cathode by repeating the step of dipping the anode body in the solution or dispersion liquid under atmospheric pressure and subsequent heat decomposition or drying.
7. The method for producing the solid electrolytic capacitor as claimed in claim 1 , wherein the valve-acting sintered body is a sintered body of powder selected from tantalum powder, niobium powder, alloy powder mainly comprising tantalum, alloy powder mainly comprising niobium and niobium monoxide powder.
8. The method for producing the solid electrolytic capacitor as claimed in claim 1 , wherein the predetermined depth is 10% of a total height of the electrolytic capacitor.