Apparatus for depositing viscous material including transport system with upper and lower tracks
Disclosed herein is an apparatus for depositing viscous material on an electronic substrate. The apparatus comprises a frame, an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate, a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position, and a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including an upper track and a lower track disposed below the upper track.
1. An apparatus for depositing viscous material on an electronic substrate, the apparatus comprising:
a frame;
an assembly material applicator coupled to the frame and configured to apply assembly material to the electronic substrate;
a substrate support assembly, coupled to the frame, configured to support and secure the electronic substrate in a material application position; and
a transport system, coupled to the frame, to shuttle electronic substrates to and from the substrate support assembly, the transport system including:
an upper track extending through the apparatus;
a lower track extending through the apparatus, the lower track disposed directly below the upper track; and
a displacement mechanism configured to raise the upper track relative to the lower track.
2. The apparatus of claim 1 , further comprising a controller configured to control the operation of the apparatus, said controller located external to the apparatus.
3. The apparatus of claim 1 , wherein the frame includes a fixed frame member and a movable frame member coupled to the fixed frame member.
4. The apparatus of claim 3 , wherein the movable frame member is movably secured to the fixed frame member by linear bearings.
5. The apparatus of claim 4 , wherein the frame further includes a mechanism to move the movable frame member with respect to the fixed frame member.
6. The apparatus of claim 1 , wherein the apparatus is configured as a stencil printer and the assembly material comprises at least one of a solder paste and a conductive ink.
7. The apparatus of claim 1 , wherein the assembly material comprises an encapsulent.
8. The apparatus of claim 1 , wherein the apparatus is configured as a direct write printer and the assembly material comprises at least one of a solder paste and a conductive ink.
9. The apparatus of claim 1 , wherein the lower track is configured to be removed from the apparatus without disrupting an operation of the assembly material applicator or disrupting an operation of the upper track.
10. The apparatus of claim 9 , wherein removal of the lower track provides an opening in the apparatus of a sufficient size so that an alternate transport system may be coupled to the apparatus and assume a function of the lower track.
11. The apparatus of claim 1 , wherein a transport width of at least one of the upper track and the lower track is adjustable.