IP Library Granted Patent US 8,500,964
Granted Patent B2
US 8,500,964 · App. 12/610,736 · Granted Aug 6, 2013

Method of fabricating bubble-type micro-pump

Inventor: Chen Peng (Taipei, TW)
Assignee: Benq Materials Corp.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,500,964
App. No.
12/610,736
Granted
Aug 6, 2013
Kind
B2
Abstract

A manufacturing method of a bubble-type micro-pump is provided. At least a bubble-generating unit is provided on the bubble-generating section. Because of the varied surface energies on the top of the bubble-generating section, the varied backfilling velocities of the fluid of the front end and the rear end cause fluid moving when a bubble vanishes. The top surface of the bubble-generating section is subjected to a particular surface treatment to form a surface energy gradient. Examples of surface treatment include sputtering a thin film with varied densities or thickness, radiating one or multi-layer thin films by a laser beam, etc.

Claims (19)

1. A method of fabricating a bubble-type micro-pump, comprising:

providing a micro-channel having a top surface, a bottom surface and two side walls, the micro-channel comprising at least a bubble-generating section;

providing a bubble-generating unit in the bubble-generating section of the micro-channel, for generating a bubble in a liquid between a front end and a rear end of the bubble-generating section; and

applying a surface treatment to the top surface of the bubble-generating section to form a surface energy gradient on the top surface, so that a difference between a backfilling velocity at the front end and that at the rear end drivers the liquid to flow toward the front end or the rear end;

wherein at least two regions with different surface energies are formed by sputtering form forming the surface energy gradient on the top surface;

wherein a step of forming the surface energy gradient on the top surface comprises:

sputtering a film on the top surface of the bubble-generating section, and the thickness of the film gradually increasing or decreasing from the front end to the rear end; and

sputtering the film on the top surface in the bubble-generating section, and the density of the film gradually increasing or decreasing from the front end to the rear end.

2. The method according to claim 1 , wherein the step of forming the surface energy gradient on the top surface comprises:

sputtering a first film in a first region on the top surface adjacent to the front end of the bubble-generating section, the first film having a first surface energy; and

sputtering a second film in a second region on the top surface adjacent to the rear end of the bubble-generating section, the second film having a second surface energy and connected to the first film, wherein the first surface energy is different from the second surface energy.

3. The method according to claim 1 , wherein the step of providing the micro-channels comprises:

providing a first substrate and a second substrate, the first substrate comprising at least a recess having the bubble-generating section; and

attaching the first substrate and the second substrate, wherein the surface of the recess forms the top surface and the two walls of the micro-channel, and surface of the second substrate forms the bottom surface of the micro-channel.

4. The method according to claim 3 , wherein the step of providing the bubble-generating unit comprises:

disposing a first electrode and a second electrode on the bottom surface in the bubble-generating section, the first electrode and the second electrode respectively adjacent to the front end and the rear end of the bubble-generating section.

5. The method according to claim 3 , wherein the first substrate is manufactured by a disc manufacturing process.

6. The method according to claim 3 , wherein the first substrate with the recess is manufactured by injection molding, pressure casting or etching.

7. The method according to claim 3 , wherein the first substrate and the second substrate are attached by a pressure sensitive adhesive.

Assignments (2)
CHANGE OF NAME Recorded Mar 29, 2013
From: DAXON TECHNOLOGY INC.
To: BENQ MATERIALS CORP.
Reel/Frame 030112/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2009
From: PENG, CHEN
To: DAXON TECHNOLOGY INC.
Reel/Frame 023457/0503 →
Priority Claims (1)
TW 97149831 A · Dec 19, 2008 · national
Continuity (1)
Related Publication 20100155230A1 · Jun 24, 2010