Light emitting device and method of manufacturing the same
The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
1. A method of manufacturing a light emitting device, comprising:
sequentially forming an N-type semiconductor layer, active layer, and P-type semiconductor layer on a substrate;
forming an etching mask pattern, of which a side surface is not perpendicular to but inclined at a slope from a horizontal plane, on the P-type semiconductor layer; and
removing the etching mask pattern and the P-type semiconductor layer exposed through the etching mask pattern,
wherein forming the etching mask pattern comprises:
forming a photoresist on the P-type semiconductor layer;
exposing the photoresist to light; and
developing the light-exposed photoresist without a baking process after the light exposure.
2. The method as claimed in claim 1 , further comprising:
removing a portion of the N-type semiconductor layer exposed through the removal of the P-type semiconductor layer to form a plurality of light emitting cells; and
connecting the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell through a conductive wire.
3. The method as claimed in claim 1 , further comprising the step of flip-chip bonding the substrate onto an additional submount substrate after the step of removing the P-type semiconductor layer and the etching mask pattern.
4. The method as claimed in claim 3 , further comprising the steps of:
removing a portion of the N-type semiconductor layer exposed due to the removal of the P-type semiconductor layer to form a plurality of light emitting cell; and
connecting the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell through a conductive wire, after the step of removing the P-type semiconductor layer and the etching mask pattern.
5. The method as claimed in claim 2 , wherein the forming the plurality of light emitting cells comprises:
forming an etching mask pattern, of which side surface is not perpendicular to but inclined at a predetermined slope from a horizontal plane, on the P-type semiconductor layer;
removing the N-type and P-type semiconductor layers exposed through the etching mask pattern to form a plurality of light emitting cells; and
removing the etching mask pattern.
6. The method as claimed in claim 2 , wherein the N type semiconductor layer of one light emitting cell and the P type semiconductor layer of another adjacent light emitting cell are connected with the conductive wire through a bridge or step coverage process.
7. The method as claimed in claim 1 , wherein the photoresist with a thickness of 3 to 50 μm is used in the forming the etching mask pattern.
8. The method as claimed in claim 1 , further comprising:
after the removing the P-type semiconductor layer and the etching mask pattern,
removing a rear surface of the substrate at a certain thickness; and
depositing Al, Ti, Ag, W, Ta, Ni, Ru or an alloy thereof onto the rear surface of the substrate.
9. A method of manufacturing a light emitting device, comprising:
sequentially forming an N-type semiconductor layer, active layer, and P-type semiconductor layer on a substrate;
forming an etching mask pattern, of which a side surface is not perpendicular to but inclined at a slope from a horizontal plane, on the P-type semiconductor layer; and
removing the etching mask pattern and the P-type semiconductor layer exposed through the etching mask pattern,
wherein forming the etching mask pattern comprises:
forming a photoresist on the P-type semiconductor layer;
exposing the photoresist to light;
hard-baking and developing the photoresist; and
etching a side surface of the developed photoresist to have the slope from the horizontal plane.
10. The method as claimed in claim 9 , further comprising:
removing a portion of the N-type semiconductor layer exposed through the removal of the P-type semiconductor layer to form a plurality of light emitting cells; and
connecting the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell through a conductive wire.
11. The method as claimed in claim 10 , wherein the forming the plurality of light emitting cells comprises:
forming an etching mask pattern, of which a side surface is not perpendicular to but inclined at a predetermined slope from a horizontal plane, on the P-type semiconductor layer;
removing the N-type and P-type semiconductor layers exposed through the etching mask pattern to form a plurality of light emitting cells; and
removing the etching mask pattern.
12. The method as claimed in claim 10 , wherein the N type semiconductor layer of one light emitting cell and the P type semiconductor layer of another adjacent light emitting cell are connected with the conductive wire through a bridge or step coverage process.
13. The method as claimed in claim 9 , wherein the photoresist with a thickness of 3 to 50 μm is used in the forming the etching mask pattern.
14. The method as claimed in claim 9 , further comprising:
after the removing the P-type semiconductor layer and the etching mask pattern,
removing a rear surface of the substrate at a certain thickness; and
depositing Al, Ti, Ag, W, Ta, Ni, Ru or an alloy thereof onto the rear surface of the substrate.
15. The method as claimed in claim 9 , wherein the hard-baking is performed at a temperature of 100 to 140° C.